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Journal Articles

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Hideo Koguchi, Kazuhisa Hoshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020902.
https://doi.org/10.1115/1.4006139
Published Online: June 11, 2012
View Article titled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure
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Topics: Bonding, Boundary element methods, Delamination, Resins, Stress, Stress singularity, Silicon, Joining, Stress concentration
Journal Articles

Joint Level Test Methods for Solder Pad Cratering Investigations

Brian D. Roggeman, Venkatesh Raghavan, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031007.
https://doi.org/10.1115/1.4004182
Published Online: September 14, 2011
View Article titled, Joint Level Test Methods for Solder Pad Cratering Investigations
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Topics: Laminates, Resins, Shear (Mechanics), Solders, Testing, Stress, Failure, Temperature
Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
https://doi.org/10.1115/1.4001854
Published Online: September 9, 2010
View Article titled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
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Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels
Journal Articles

Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
https://doi.org/10.1115/1.4000718
Published Online: March 4, 2010
View Article titled, Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process
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Topics: Electron mobility, Molding, Resins, Stress, Silicon
Journal Articles

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
https://doi.org/10.1115/1.2993126
Published Online: November 14, 2008
View Article titled, Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
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Topics: Copper, Flow (Dynamics), Heat, Heat conduction, Insulation, Laminates, Modeling, Printed circuit boards, Resins, Temperature
Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
https://doi.org/10.1115/1.2912180
Published Online: May 8, 2008
View Article titled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
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Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins
Journal Articles

Modeling of Resin Flow in Reinforced Dielectric Prepregs

Pavel Simacek, Suresh G. Advani, Kossi Zonvide, Leonard W. Barrett
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021001.
https://doi.org/10.1115/1.2837510
Published Online: April 15, 2008
View Article titled, Modeling of Resin Flow in Reinforced Dielectric Prepregs
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Topics: Copper, Flow (Dynamics), Pressure, Resins, Printed circuit boards, Permeability, Viscosity, Porosity
Journal Articles

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Slawomir Rubinsztajn, Donald Buckley, John Campbell, David Esler, Eric Fiveland, Ananth Prabhakumar, Donna Sherman, Sandeep Tonapi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 77–85.
https://doi.org/10.1115/1.1846067
Published Online: June 3, 2005
View Article titled, Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials
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Topics: Fillers (Materials), Flip-chip devices, Flow (Dynamics), Reliability, Resins, Semiconductor wafers, Flip-chip, Thermal expansion, Epoxy resins, Solder joints
Journal Articles

Adhesive Joining Process and Joint Property With Low Melting Point Filler

Kiyokazu Yasuda, Jong-Min Kim, Kozo Fujimoto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
https://doi.org/10.1115/1.1846060
Published Online: March 21, 2005
View Article titled, Adhesive Joining Process and Joint Property With Low Melting Point Filler
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Topics: Adhesives, Alloys, Fillers (Materials), Heat conduction, Melting point, Resins, Joining, Copper, Epoxy resins, Self-organization
Journal Articles

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

Man-Lung Sham, Jang-Kyo Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
https://doi.org/10.1115/1.1849232
Published Online: March 21, 2005
View Article titled, Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
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Topics: Residual stresses, Resins, Strips, Numerical analysis, Temperature, Finite element analysis, Stress
Journal Articles

Resin Self-Alignment Processes for Self-Assembly Systems

Jong-Min Kim, Kiyokazu Yasuda, Kozo Fujimoto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
https://doi.org/10.1115/1.1846061
Published Online: March 21, 2005
View Article titled, Resin Self-Alignment Processes for Self-Assembly Systems
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Topics: Resins, Surface tension, Self-assembly
Journal Articles

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

Takehiro Saitoh, Hidehito Matsuyama, Masayuki Toya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 420–425.
https://doi.org/10.1115/1.1602706
Published Online: September 17, 2003
View Article titled, Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading
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Topics: Delamination, Fracture (Process), Resins, Temperature, Copper alloys, Fracture mechanics, Alloys, Radioactive tracers, Wedges, Cracking (Materials)
Journal Articles

Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

Timothy Ferguson, Mem. ASME, Jianmin Qu, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 24–30.
https://doi.org/10.1115/1.1524132
Published Online: March 14, 2003
View Article titled, Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials
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Topics: Absorption, Diffusion (Physics), Fracture (Materials), Fracture (Process), Resins, Fracture toughness
Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
https://doi.org/10.1115/1.1501304
Published Online: December 12, 2002
View Article titled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination
Journal Articles

Electrically Conductive Adhesive Formulations for SMT Applications

Ryszard Kisiel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 367–370.
https://doi.org/10.1115/1.1497628
Published Online: December 12, 2002
View Article titled, Electrically Conductive Adhesive Formulations for SMT Applications
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Topics: Adhesive joints, Adhesives, Mechanical properties, Resins, Fillers (Materials), Experimental design, Adhesion, Finishing
Journal Articles

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Dagmar Beyerlein, Lee E. Hornberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 366–371.
https://doi.org/10.1115/1.1388562
Published Online: February 6, 2001
View Article titled, Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept
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Topics: Cavities, Design, Flow (Dynamics), Molding, Resins, Simulation, Wire, Deformation, Computer software, Gates (Closures)
Journal Articles

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

R. Venkatraman, K. Ramakrishna, Mem. ASME, K. Knadle, W. T. Chen, Fellow ASME, G. C. Haddon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 6–15.
https://doi.org/10.1115/1.1326437
Published Online: July 1, 2000
View Article titled, Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards
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Topics: Copper, Double refraction, Drilling, Drills (Tools), Epoxy resins, Failure, Failure analysis, Finite element analysis, Fracture (Materials), Glass
Journal Articles

Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages

H. Fre´mont, J. Y. Dele´tage, A. Pintus, Y. Danto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 16–18.
https://doi.org/10.1115/1.1326436
Published Online: January 1, 2000
View Article titled, Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages
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Topics: Diffusion (Physics), Molding, Resins, Water, Polymers, Diffusion processes, Weight (Mass), Ceramics, Finite element analysis, Geometry
Journal Articles

Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

J. Zhang, C. Q. Cui, T. B. Lim, E. T. Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 291–296.
https://doi.org/10.1115/1.2793855
Published Online: December 1, 1999
View Article titled, Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
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Topics: Copper, Epoxy resins, Lamination, Printed circuit boards, Adhesion, Resins, Plasmas (Ionized gases), Atomic force microscopy, Polymerization, Temperature
Journal Articles

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

Mary J. Li, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 225–229.
https://doi.org/10.1115/1.2792096
Published Online: September 1, 1995
View Article titled, Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages
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Topics: Electronic packages, Electrons, Failure mechanisms, Bonding, Failure, Fibers, Microcracks, Printed circuit boards, Resins, Scanning electron microscopy