1-20 of 21
Signals
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Acoustic Characterization of Integrated Circuits During Operation

Josef Frankhouse, Changgen Li, Han Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041103.
Paper No: EP-24-1036
https://doi.org/10.1115/1.4065649
Published Online: June 20, 2024
View Article titled, Acoustic Characterization of Integrated Circuits During Operation
Open the PDF for Acoustic Characterization of Integrated Circuits During Operation in another window
Topics: Acoustic emissions, Acoustics, Electronics, Integrated circuits, Signals, Stress, Waves, Sensors, Monitoring systems
Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
Open the PDF for Special Issue on InterPACK2022 in another window
Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
Open the PDF for High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology in another window
Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Article titled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
Open the PDF for A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique in another window
Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021111.
Paper No: EP-21-1067
https://doi.org/10.1115/1.4052630
Published Online: December 1, 2021
View Article titled, Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads
Open the PDF for Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads in another window
Topics: Failure, Service life (Equipment), Signals, Temperature, Vibration, Principal component analysis
Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Article titled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
Open the PDF for Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals in another window
Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Article titled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
Open the PDF for Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging in another window
Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011011.
Paper No: EP-20-1039
https://doi.org/10.1115/1.4047577
Published Online: July 23, 2020
View Article titled, Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads
Open the PDF for Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads in another window
Topics: Signals, Vibration
Journal Articles

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Guoyi Li, Hyunseong Lee, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011002.
Paper No: EP-19-1077
https://doi.org/10.1115/1.4047228
Published Online: June 4, 2020
View Article titled, Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation
Open the PDF for Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation in another window
Topics: Delamination, Inspection, Sealants, Signals, Waves, Nondestructive evaluation, Excitation, Integrated circuits
Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031106.
Paper No: EP-19-1098
https://doi.org/10.1115/1.4046848
Published Online: April 24, 2020
View Article titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
Open the PDF for Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach in another window
Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles
Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031006.
Paper No: EP-14-1030
https://doi.org/10.1115/1.4030065
Published Online: September 1, 2015
View Article titled, Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics
Open the PDF for Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics in another window
Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics
Journal Articles

Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Pradeep Lall, Ryan Lowe, Kai Goebel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021001.
https://doi.org/10.1115/1.4006706
Published Online: June 11, 2012
View Article titled, Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact
Open the PDF for Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact in another window
Topics: Damage, Electronics, Failure, Shock (Mechanics), Solders, Spectroscopy, Vibration, Signals, Phase shift, Stress
Journal Articles

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Wuwei Feng, Qingfeng Meng, Youbo Xie, Hong Fan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
https://doi.org/10.1115/1.4002900
Published Online: November 19, 2010
View Article titled, On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
Open the PDF for On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator in another window
Topics: Bonding, Feature extraction, Signals, Wire bonding, Generators, Principal component analysis, Wire, Damping, Artificial neural networks, Shear strength
Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
https://doi.org/10.1115/1.3068301
Published Online: February 18, 2009
View Article titled, Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals
Open the PDF for Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals in another window
Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection
Journal Articles

Flip-Chip Interconnect for Coplanar Strip Lines

Young K. Song, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044501.
https://doi.org/10.1115/1.2993140
Published Online: November 17, 2008
View Article titled, Flip-Chip Interconnect for Coplanar Strip Lines
Open the PDF for Flip-Chip Interconnect for Coplanar Strip Lines in another window
Topics: Flip-chip, Strips, Circuits, Solders, Signals, Waveguides
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
Open the PDF for Microscale and Nanoscale Thermal Characterization Techniques in another window
Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method

Siva P. Gurrum, Yogendra K. Joshi, William P. King, Koneru Ramakrishna, Martin Gall
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031001.
https://doi.org/10.1115/1.2957318
Published Online: July 29, 2008
View Article titled, A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method
Open the PDF for A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method in another window
Topics: Finite element methods, Heat conduction, Metals, Modeling, Simulation, Temperature, Chain, Finite element analysis, Thermal conductivity, Clocks
Journal Articles

Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

Sheng Liu, I. Charles Ume, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 39–43.
https://doi.org/10.1115/1.1525820
Published Online: March 14, 2003
View Article titled, Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System
Open the PDF for Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System in another window
Topics: Errors, Flip-chip devices, Inspection, Signal processing, Signals, Solder joints, Flip-chip, Data acquisition, Vibration
Journal Articles

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

Sheng Liu, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 221–226.
https://doi.org/10.1115/1.1464878
Published Online: July 26, 2002
View Article titled, Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection
Open the PDF for Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection in another window
Topics: Flip-chip, Flip-chip devices, Inspection, Modeling, Signals, Solder joints, Solders, Vibration, Vibration analysis, Oscillating frequencies
Journal Articles

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

R. Venkatraman, K. Ramakrishna, Mem. ASME, K. Knadle, W. T. Chen, Fellow ASME, G. C. Haddon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 6–15.
https://doi.org/10.1115/1.1326437
Published Online: July 1, 2000
View Article titled, Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards
Open the PDF for Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards in another window
Topics: Copper, Double refraction, Drilling, Drills (Tools), Epoxy resins, Failure, Failure analysis, Finite element analysis, Fracture (Materials), Glass