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Journal Articles

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
https://doi.org/10.1115/1.4047063
Published Online: May 13, 2020
View Article titled, Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cycles, Melting, Metals, Solidification, Temperature, Alloys, Stability
Journal Articles

Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps

Daijiao Wang, Ronald L. Panton
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 440–445.
https://doi.org/10.1115/1.2070047
Published Online: January 4, 2005
View Article titled, Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps
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Topics: Cooling, Heat flux, Heating, Solders, Solidification, Melting, Flow (Dynamics)
Journal Articles

The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints

Y. C. Chan, S. H. Fan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
https://doi.org/10.1115/1.1537070
Published Online: March 14, 2003
View Article titled, The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints
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Topics: Cooling, Crystallization, Diffusion (Physics), Intermetallic compounds, Solder joints, Solders, Tin, Temperature, Solidification, Ball-Grid-Array packaging
Journal Articles

Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging

Suman Chakraborty, Pradip Dutta, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 126–133.
https://doi.org/10.1115/1.1535445
Published Online: March 14, 2003
View Article titled, Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging
Open the PDF for Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging in another window
Topics: Freezing, Heat transfer, Melting, Packaging, Solidification, Temperature distribution, Phase change materials, Convection
Journal Articles

Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

S. H. Fan, Y. C. Chan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
https://doi.org/10.1115/1.1347997
Published Online: July 14, 1999
View Article titled, Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds
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Topics: Conveyor systems, Cooling, Cycles, Fatigue, Shear (Mechanics), Solder joints, Solders, Ball-Grid-Array packaging, Heat transfer, Solidification
Journal Articles

A Novel High Performance Die Attach for Ceramic Packages

J. Z. Shi, X. M. Xie, F. Stubhan, J. Freytag
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 168–171.
https://doi.org/10.1115/1.483150
Published Online: March 15, 1999
View Article titled, A Novel High Performance Die Attach for Ceramic Packages
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Topics: Bonding, Ceramics, Cycles, Shear strength, Solidification, Temperature
Journal Articles

Undercooling of 63SN-37PB Solder Pastes

Zequn Mei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 105–108.
https://doi.org/10.1115/1.2792075
Published Online: June 1, 1995
View Article titled, Undercooling of 63SN-37PB Solder Pastes
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Topics: Solders, Supercooling, Aluminum, Cooling, Copper, Solidification, Wetting, Manufacturing, Nucleation (Physics), Solder joints
Journal Articles

Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates

Z. Mei, J. W. Morris, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 104–108.
https://doi.org/10.1115/1.2906404
Published Online: June 1, 1992
View Article titled, Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates
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Topics: Cooling, Fatigue, Solder joints, Furnaces, Grain size, Quenching (Metalworking), Shear (Mechanics), Solidification
Journal Articles

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

L. J. Huang, K. Ramakrishna, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 199–206.
https://doi.org/10.1115/1.3226534
Published Online: September 1, 1989
View Article titled, An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process
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Topics: Aluminum, Bonding, Porosity, Shrinkage (Materials), Alloys, Metals, Density, Solidification, Accounting, Geometry