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1-20 of 561
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Journal Articles
Accepted Manuscript
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag.
Paper No: EP-22-1060
Published Online: January 23, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
Published Online: January 11, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011108.
Paper No: EP-22-1030
Published Online: December 23, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
Published Online: December 23, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011106.
Paper No: EP-22-1021
Published Online: November 23, 2022
Topics:
Cycles,
Life testing,
Stress,
Temperature,
Testing,
Thermal resistance,
Vibration,
Electronics,
Reliability,
Heating
Includes: Supplementary data
Journal Articles
Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
Published Online: November 11, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
Published Online: October 22, 2022
Journal Articles
Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
Published Online: September 28, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
Published Online: September 28, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011102.
Paper No: EP-22-1016
Published Online: September 27, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
Published Online: September 27, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021002.
Paper No: EP-22-1037
Published Online: August 8, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
Published Online: August 3, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011205.
Paper No: EP-22-1001
Published Online: August 3, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021119.
Paper No: EP-21-1057
Published Online: April 22, 2022
Journal Articles
Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
Published Online: April 22, 2022
Topics:
Deformation,
Electrical resistance,
Fatigue,
Metals,
Molding,
Polymers,
Reliability,
Silicon,
Simulation,
Stress
Includes: Supplementary data
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
Published Online: March 31, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
Published Online: March 11, 2022
Journal Articles
Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041015.
Paper No: EP-21-1139
Published Online: February 23, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
Published Online: December 27, 2021