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Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Article titled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031005.
Paper No: EP-18-1076
https://doi.org/10.1115/1.4042982
Published Online: April 10, 2019
View Article titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Open the PDF for Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging in another window
Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy
Journal Articles

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020907.
https://doi.org/10.1115/1.4006707
Published Online: June 11, 2012
View Article titled, Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects
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Topics: Diffusion (Physics), Electrodiffusion, Solder joints, Solders, Stress, Flip-chip, Finite element analysis, Grain boundary diffusion, Electric potential, Surface energy
Journal Articles

Wetting Dynamics of Molten Solder Alloys on Metal Substrates

T. J. Singler, J. A. Clum, E. R. Prack
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 128–134.
https://doi.org/10.1115/1.2906409
Published Online: June 1, 1992
View Article titled, Wetting Dynamics of Molten Solder Alloys on Metal Substrates
Open the PDF for Wetting Dynamics of Molten Solder Alloys on Metal Substrates in another window
Topics: Alloys, Dynamics (Mechanics), Metals, Solders, Wetting, Surface energy, Tin, Tin alloys