1-5 of 5
Telecommunications
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Reviewer's Recognition

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2018, 140(2): 020201.
Paper No: EP-18-1022
https://doi.org/10.1115/1.4039660
Published Online: May 9, 2018
View Article titled, Reviewer's Recognition
Open the PDF for Reviewer's Recognition in another window
Topics: Telecommunications
Journal Articles

Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards

Jinny Rhee, Sergio I. Hernandez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2006, 128(4): 484–493.
https://doi.org/10.1115/1.2353327
Published Online: January 9, 2006
View Article titled, Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards
Open the PDF for Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards in another window
Topics: Temperature, Telecommunications, Heating, Reynolds number
Journal Articles

First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. December 2002, 124(4): 432.
https://doi.org/10.1115/1.1510861
Published Online: December 12, 2002
View Article titled, First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability
Open the PDF for First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability in another window
Topics: Electronic products, Liabilities, Reliability, Telecommunications, Testing
Journal Articles

Thermal Management in Direct Chip Attach Assemblies

D. F. Baldwin, J. T. Beerensson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 222–230.
https://doi.org/10.1115/1.2793844
Published Online: December 1, 1999
View Article titled, Thermal Management in Direct Chip Attach Assemblies
Open the PDF for Thermal Management in Direct Chip Attach Assemblies in another window
Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions
Journal Articles

Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates

E. B. Zimmerman, H. Hegab, G. T. Colwell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 50–54.
https://doi.org/10.1115/1.2792661
Published Online: March 1, 1999
View Article titled, Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates
Open the PDF for Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates in another window
Topics: Axial flow, Cold climates, Computer simulation, Containers, Convection, Cooling, Cooling systems, Electronics, Fans, Flow (Dynamics)