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Journal Articles

Effect of Design Parameters on Thermomechanical Stress in Silicon of Through-Silicon Via

Joo-Sun Hwang, Seung-Ho Seo, Won-Jun Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031006.
Paper No: EP-15-1054
https://doi.org/10.1115/1.4033923
Published Online: June 28, 2016
View Article titled, Effect of Design Parameters on Thermomechanical Stress in Silicon of Through-Silicon Via
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Topics: Copper, Design, Silicon, Stress, Thermomechanics, Stress concentration, Annealing, Yield stress
Journal Articles

Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

Haruo Nose, Lecturer,, Masao Sakane, Professor,, Yutaka Tsukada, Researcher, Hideo Nishimura, Researcher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 59–66.
https://doi.org/10.1115/1.1533058
Published Online: March 14, 2003
View Article titled, Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders
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Topics: Solders, Temperature, Tensile strength, Tin, Yield stress, Young's modulus, Creep, Stress
Journal Articles

A Model Study of Thermal Stress-Induced Voiding in Electronic Packages

Y. Huang, K. X. Hu, C. P. Yeh, N.-Y. Li, K. C. Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 229–234.
https://doi.org/10.1115/1.2792157
Published Online: December 1, 1996
View Article titled, A Model Study of Thermal Stress-Induced Voiding in Electronic Packages
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Topics: Electronic packages, Stress, Cavitation, Solids, Adhesives, Design, Failure mechanisms, Hardening, Hydrostatics, Integrated circuits
Journal Articles

Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests

J. A. Owczarek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 233–239.
https://doi.org/10.1115/1.2909323
Published Online: September 1, 1993
View Article titled, Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests
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Topics: Coating processes, Coatings, Electronic components, Yield stress, Circuits, Die cutting, Flow (Dynamics), Shear stress, Shearing (Deformation)
Journal Articles

Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter

J. A. Owczarek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 240–248.
https://doi.org/10.1115/1.2909324
Published Online: September 1, 1993
View Article titled, Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter
Open the PDF for Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter in another window
Topics: Coating processes, Coatings, Electronic components, Skin, Yield stress, Die cutting, Disperse systems, Electronic circuits, Flow (Dynamics), Shear stress