Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 1087

2 3 4 5

Sort by

Sort Order Select

Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. December 2022, 144(4): 041009.

Paper No: EP-21-1137

DOI: https://doi.org/10.1115/1.4052920

Published Online: December 1, 2022

View Article

Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation

Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen

J. Electron. Packag.

Paper No: EP-22-1001

DOI: https://doi.org/10.1115/1.4054821

Published Online: June 16, 2022

View Article

Topics: Algebra, Deformation, Differential equations, Errors, Genetic algorithms, Solders, Stress

Journal Articles

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

Ting-Chuan Huang, Kuo-Chi Liao

J. Electron. Packag.

Paper No: EP-22-1010

DOI: https://doi.org/10.1115/1.4054822

Published Online: June 16, 2022

View Article

Topics: Shock (Mechanics), Contact resistance, Displacement, Molten salt reactors, Dynamic response, Finite element analysis, Surface roughness

Journal Articles

Viscoelastic Influence On the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag.

Paper No: EP-21-1110

DOI: https://doi.org/10.1115/1.4054784

Published Online: June 13, 2022

View Article

Topics: Semiconductor wafers, Reliability, Viscoelasticity, Electronic packages, Glass transition, Manufacturing, Printed circuit boards, Creep, Design, Elastic moduli

Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for GaN HEMTs

Han-ling Li, Yang Shen, Yu-Chao Hua, S.L. Sobolev, Bing-Yang Cao

J. Electron. Packag.

Paper No: EP-22-1007

DOI: https://doi.org/10.1115/1.4054698

Published Online: June 1, 2022

View Article

Topics: Diffusion (Physics), Gallium nitride, Heating, Modeling, Phonons, Temperature, Heat, Simulation, Heat conduction, Electromagnetic scattering

Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin Sharar, Michael Fish, Patrick J. Shamberger

J. Electron. Packag.

Paper No: EP-21-1153

DOI: https://doi.org/10.1115/1.4054651

Published Online: May 25, 2022

View Article

Topics: Heat, Phase change materials, Slabs, Heat sinks, Transients (Dynamics), Steady state, Thermal resistance, Tradeoffs, Boundary-value problems, Cooling

Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. September 2022, 144(3): 031017.

Paper No: EP-21-1164

DOI: https://doi.org/10.1115/1.4054461

Published Online: May 19, 2022

View Article

Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer

Journal Articles

Electro-Thermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian

J. Electron. Packag.

Paper No: EP-22-1014

DOI: https://doi.org/10.1115/1.4054462

Published Online: May 2, 2022

View Article

Topics: Aerospace industry, Systems analysis, Temperature, Errors, Reliability, Vacuum, Design, Electronic products, Failure, Sensors

Journal Articles

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

Zuraihana Bachok, Mohamad Aizat Abas, Muhammad Zaim Hanif Nazarudin, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041018.

Paper No: EP-21-1157

DOI: https://doi.org/10.1115/1.4054132

Published Online: April 22, 2022

View Article

Topics: Lasers, Soldering, Solders

Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim

J. Electron. Packag. December 2022, 144(4): 041017.

Paper No: EP-21-1014

DOI: https://doi.org/10.1115/1.4054183

Published Online: April 22, 2022

View Article

Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress

Includes: Supplementary data

Journal Articles

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Sara K. Lyons, Aditya Chandramohan, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2022, 144(4): 041019.

Paper No: EP-21-1161

DOI: https://doi.org/10.1115/1.4054263

Published Online: April 22, 2022

View Article

Topics: Resolution (Optics), Temperature, Thermography, Deformation, Temperature measurement, Emissivity

Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla

J. Electron. Packag. December 2022, 144(4): 041016.

Paper No: EP-21-1159

DOI: https://doi.org/10.1115/1.4054096

Published Online: March 31, 2022

View Article

Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure

Journal Articles

A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules

Feifei Yan, Laili Wang, Yongmei Gan, Kaixuan Li, Boya Zhang

J. Electron. Packag. September 2022, 144(3): 031016.

Paper No: EP-21-1168

DOI: https://doi.org/10.1115/1.4053891

Published Online: March 11, 2022

View Article

Topics: Ceramics, Electric fields, Electrodes, Silicones, Insulation

Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031014.

Paper No: EP-21-1121

DOI: https://doi.org/10.1115/1.4053889

Published Online: March 8, 2022

View Article

Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability

Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour

J. Electron. Packag. September 2022, 144(3): 031015.

Paper No: EP-21-1151

DOI: https://doi.org/10.1115/1.4053890

Published Online: March 8, 2022

View Article

Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling

Journal Articles

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

Louis Schuler, Ludovic Chamoin, Zoubir Khatir, Mounira Berkani, Merouane Ouhab, Nicolas Degrenne

J. Electron. Packag. September 2022, 144(3): 031013.

Paper No: EP-21-1138

DOI: https://doi.org/10.1115/1.4053767

Published Online: March 7, 2022

View Article

Topics: Design, Solder joints, Temperature, Thermomechanics, Geometry, Finite element analysis, Convection, Cycles, Sensitivity analysis

Journal Articles

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia

J. Electron. Packag. December 2022, 144(4): 041015.

Paper No: EP-21-1139

DOI: https://doi.org/10.1115/1.4053643

Published Online: February 23, 2022

View Article

Topics: Air flow, Design, Stress, Flow (Dynamics), Control systems, Heat, Data centers, Inertia (Mechanics)

Journal Articles

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Zhigang Gao, Tianhu Wang, Yuxin Yang, Xiaolong Shang, Junhua Bai, Peng Li

J. Electron. Packag. December 2022, 144(4): 041014.

Paper No: EP-21-1134

DOI: https://doi.org/10.1115/1.4053433

Published Online: February 7, 2022

View Article

Topics: Flow (Dynamics), Heat sinks, Heat transfer, Methane, Microchannels, Pressure, Electromechanical actuators

Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu

J. Electron. Packag. December 2022, 144(4): 041013.

Paper No: EP-21-1109

DOI: https://doi.org/10.1115/1.4053432

Published Online: February 1, 2022

View Article

Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)

Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2022, 144(4): 041011.

Paper No: EP-21-1119

DOI: https://doi.org/10.1115/1.4053310

Published Online: January 28, 2022

View Article

Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes

2 3 4 5

Journal citation

NARROW

Supplemental Material

Manuscript

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

Viscoelastic Influence On the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for GaN HEMTs

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Electro-Thermal Analysis of System in Package for Aerospace Application

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only