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Journal Articles

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu

J. Electron. Packag. June 2022, 144(2): 020801.

Paper No: EP-21-1008

DOI: https://doi.org/10.1115/1.4052069

Published Online: September 24, 2021

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Topics: Sensors, Bonding, Electronics

Journal Articles

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi

J. Electron. Packag. September 2021, 143(3): 030801.

Paper No: EP-19-1124

DOI: https://doi.org/10.1115/1.4048861

Published Online: January 19, 2021

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Topics: Heat sinks, Metal foams, Heat transfer

Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee

J. Electron. Packag. March 2021, 143(1): 010801.

Paper No: EP-20-1051

DOI: https://doi.org/10.1115/1.4047414

Published Online: June 29, 2020

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Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy

Journal Articles

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu

J. Electron. Packag. December 2020, 142(4): 040801.

Paper No: EP-19-1126

DOI: https://doi.org/10.1115/1.4047472

Published Online: June 29, 2020

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Topics: Architecture, Cooling, Design, Electric vehicles, Electronics, Patents, Hybrid electric vehicles, Traction, Coolants, Metals

Journal Articles

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Yang Peng, Renli Liang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Xiaobing Luo

J. Electron. Packag. December 2019, 141(4): 040804.

Paper No: EP-18-1089

DOI: https://doi.org/10.1115/1.4044624

Published Online: September 19, 2019

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Topics: Light-emitting diodes, Packaging, Ultraviolet radiation

Journal Articles

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo

J. Electron. Packag. March 2020, 142(1): 010801.

Paper No: EP-18-1105

DOI: https://doi.org/10.1115/1.4044359

Published Online: September 19, 2019

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Topics: Lasers, Packaging, Phosphors, Quenching (Metalworking), Temperature, Laser beams, Brightness (Photometry)

Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A. Bar-Cohen, J. J. Maurer, D. H. Altman

J. Electron. Packag. December 2019, 141(4): 040803.

Paper No: EP-18-1067

DOI: https://doi.org/10.1115/1.4043404

Published Online: July 30, 2019

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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management

Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha

J. Electron. Packag. December 2019, 141(4): 040802.

Paper No: EP-18-1117

DOI: https://doi.org/10.1115/1.4043405

Published Online: May 17, 2019

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Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders

Journal Articles

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

John H. Lau

J. Electron. Packag. December 2019, 141(4): 040801.

Paper No: EP-18-1088

DOI: https://doi.org/10.1115/1.4043341

Published Online: May 17, 2019

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Topics: Packaging, Semiconductor wafers, Solders, Warping, Etching

Journal Articles

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Aastha Uppal, Jerrod Peterson, Je-Young Chang, Xi Guo, Frank Liang, Weihua Tang

J. Electron. Packag. March 2019, 141(1): 010803.

Paper No: EP-18-1053

DOI: https://doi.org/10.1115/1.4042801

Published Online: March 4, 2019

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Topics: Design, Modeling, Thermomechanics, Stress, Heat pipes, Pressure

Journal Articles

Liquid Cooling of Compute System

Jessica Gullbrand, Mark J. Luckeroth, Mark E. Sprenger, Casey Winkel

J. Electron. Packag. March 2019, 141(1): 010802.

Paper No: EP-18-1054

DOI: https://doi.org/10.1115/1.4042802

Published Online: March 1, 2019

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Topics: Cooling, Design, Fluids, Plates (structures), Flow (Dynamics), Manifolds, Temperature

Journal Articles

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Phil Geng

J. Electron. Packag. March 2019, 141(1): 010801.

Paper No: EP-18-1046

DOI: https://doi.org/10.1115/1.4042800

Published Online: February 25, 2019

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Topics: Design, Shock (Mechanics), Solder joints, Stress, Structural design, Vibration, Failure, Creep

Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou

J. Electron. Packag. June 2019, 141(2): 020801.

Paper No: EP-18-1026

DOI: https://doi.org/10.1115/1.4041813

Published Online: February 25, 2019

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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry

Journal Articles

Technological Advances to Maximize Solar Collector Energy Output: A Review

Swapnil S. Salvi, Vishal Bhalla, Robert A. Taylor, Vikrant Khullar, Todd P. Otanicar, Patrick E. Phelan, Himanshu Tyagi

J. Electron. Packag. December 2018, 140(4): 040802.

Paper No: EP-18-1036

DOI: https://doi.org/10.1115/1.4041219

Published Online: October 1, 2018

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Topics: Coatings, Solar collectors, Solar energy

Journal Articles

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Justin Broughton, Vanessa Smet, Rao R. Tummala, Yogendra K. Joshi

J. Electron. Packag. December 2018, 140(4): 040801.

Paper No: EP-17-1128

DOI: https://doi.org/10.1115/1.4040828

Published Online: August 20, 2018

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Topics: Cooling, Electronics, Packaging, Temperature, Silicon, High temperature, Heat

Journal Articles

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

Asisa Kumar Panigrahy, Kuan-Neng Chen

J. Electron. Packag. March 2018, 140(1): 010801.

Paper No: EP-17-1076

DOI: https://doi.org/10.1115/1.4038392

Published Online: March 2, 2018

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Topics: Bonding, Low temperature

Journal Articles

Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices

Han Zhang, Alan Hedge

J. Electron. Packag. September 2017, 139(3): 030802.

Paper No: EP-16-1100

DOI: https://doi.org/10.1115/1.4037146

Published Online: July 13, 2017

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Topics: Heat, Skin, Temperature, Testing

Journal Articles

A Review on Laser Processing in Electronic and MEMS Packaging

Kaysar Rahim, Ahsan Mian

J. Electron. Packag. September 2017, 139(3): 030801.

Paper No: EP-16-1146

DOI: https://doi.org/10.1115/1.4036239

Published Online: June 14, 2017

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Topics: Lasers, Packaging

Journal Articles

Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration

Yuyan Gao, Huanyu Cheng

J. Electron. Packag. June 2017, 139(2): 020801.

Paper No: EP-16-1131

DOI: https://doi.org/10.1115/1.4036238

Published Online: June 13, 2017

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Topics: Electronics, Manufacturing, Printing, Biology

Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim

J. Electron. Packag. March 2017, 139(1): 010802.

Paper No: EP-16-1107

DOI: https://doi.org/10.1115/1.4035598

Published Online: January 16, 2017

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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure

Journal citation

NARROW

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Comparative Study on Power Module Architectures for Modularity and Scalability

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Packaging for Laser-Based White Lighting: Status and Perspectives

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Liquid Cooling of Compute System

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Technological Advances to Maximize Solar Collector Energy Output: A Review

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices

A Review on Laser Processing in Electronic and MEMS Packaging

Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

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