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Keywords: COP
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021010.
Paper No: EP-24-1093
Published Online: February 28, 2025
...Aakash Mani; Jahar Sarkar Thermoelectric coolers (TECs) have emerged as promising cooling solutions; however, their relatively low coefficient of performance (COP) remains challenging. Hence, to better understand the factors influencing TEC efficiency and to guide the design of more effective...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
Published Online: September 14, 2011
... 2011 14 09 2011 cooling graphs integrated circuit packaging thermoelectricity Thermoelectric cooler design COP performance 3D TEC system analysis In recent years, cooling high heat flux systems such as computer microprocessors, logic memory, and power supplies have...