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Keywords: Composite materials
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
Published Online: September 10, 2018
... BT Composite materials PBGA Reliability SMT Thermal analysis Warpage behavior is an important thermal–mechanical characteristic of ball grid array (BGA) devices [ 1 , 2 ]. The mechanism of BGA device warpage is related to the coefficient of thermal expansion (CTE) mismatch between...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
Published Online: June 11, 2018
..., Oct. 22–25, pp. 31 – 35 . 10.1109/SIITME.2015.7342290 [44] Maxwell , J. C. , 1873 , A Treatise on Electricity and Magnetism , Oxford , UK . [45] Pietrak , K. , and Wiśniewski , T. S. , 2015 , “ A Review of Models for Effective Thermal Conductivity of Composite Materials...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
Published Online: May 9, 2018
... manuscript received January 12, 2018; published online May 9, 2018. Assoc. Editor: Reza Khiabani. 20 09 2017 12 01 2018 Composite materials Physics of failure Thermal analysis Thermal interface materials (TIMs) play a crucial role in removing waste heat from the chip...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... LECTRONIC P ACKAGING . Manuscript received September 28, 2017; final manuscript received January 4, 2018; published online March 2, 2018. Assoc. Editor: Sreekant Narumanchi. 28 09 2017 04 01 2018 Composite materials DCA Electronic Failure analysis Harsh environment Physics...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
Published Online: March 2, 2018
... . 10.1177/002199839202601506 [34] Hull , D. , and Clyne , T. W. , 1996 , An Introduction to Composite Materials , 2nd ed. , Cambridge University Press , Cambridge, UK . [35] Kawamoto , A. , Matsumori , T. , Yamasaki , S. , Nomura , T. , Kondoh , T...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
Published Online: October 13, 2017
... January 25, 2017; final manuscript received September 24, 2017; published online October 13, 2017. Assoc. Editor: Kaushik Mysore. 25 01 2017 24 09 2017 Area array BGA Composite materials SMT Underfill In recent years, ball grid array (BGA) packages have been widely used...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031006.
Paper No: EP-17-1016
Published Online: June 30, 2017
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 11, 2017; final manuscript received April 19, 2017; published online June 30, 2017. Assoc. Editor: Yi-Shao Lai. 11 02 2017 19 04 2017 Bio-Research Composite materials Dielectrics Epoxy resin...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 26, 2015; final manuscript received March 1, 2017; published online June 14, 2017. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 01 03 2017 Composite materials COTS Failure analysis FR-4 Harsh...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2017, 139(2): 020801.
Paper No: EP-16-1131
Published Online: June 13, 2017
... December 1, 2016; final manuscript received February 22, 2017; published online June 13, 2017. Assoc. Editor: Xiaobing Luo. 01 12 2016 22 02 2017 Composite materials Electronic Flexible circuits Nanotechnolgy Given the rapid recent development in heterogeneous integration...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
Published Online: December 29, 2016
... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...
Journal Articles
Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041009.
Paper No: EP-16-1090
Published Online: October 21, 2016
... contacts between the filler particles in the composite material. The quasi-areal contacts are formed from nanoparticles self-assembled by capillary bridging, so-called necks. Thermal conductivities of up to 2.5 W/m K and 2.8 W/m K were demonstrated experimentally for the percolating and the neck-based...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030801.
Paper No: EP-15-1143
Published Online: June 8, 2016
... to a combination of the Sn matrix shear creep rate and the Ag 3 Sn IMC dispersion-hardening shear creep rate. Effect of Sn dendritic colonies was taken into account by using self-consistent homogenization schemes from micromechanics theories used in composite materials. The Sn dendrite lobes were assumed...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
Published Online: March 10, 2016
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 26, 2015; final manuscript received January 6, 2016; published online March 10, 2016. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 06 01 2016 Composite materials COTS FR-4 Harsh environment MEMS...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
... of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041006.
Published Online: October 21, 2009
..., the numerical results indicated a ratio of conductivity of filler to matrix for achieving the maximum thermal conductivity. composite materials electronics packaging finite element analysis polymers thermal conductivity composite materials thermal analysis encapsulant underfill finite element...