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Keywords: Failure Mechanism
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Journal Articles

Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)

C. L. Chung, James Fan, M. L. Huang, F. J. Tsai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 334–339.
https://doi.org/10.1115/1.1498265
Published Online: December 12, 2002
...C. L. Chung; James Fan; M. L. Huang; F. J. Tsai In this paper, the study on failure mechanism of moisture sensitivity reliability is reported. It focuses on the PCT conditions which are 121°C, 2atm, 100RH%, and 168 hr. The general failure mode is delamination on the interface between die attach...
View Article titled, Study on <span class="search-highlight">Failure</span> <span class="search-highlight">Mechanism</span> of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)
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Topics: Dams, Failure mechanisms, Reliability, Pressure, Shear strength, Shear (Mechanics), Delamination, Optical microscopes