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Keywords: Metal Via
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 294–300.
Published Online: May 15, 2000
... laminar layer. The magnitude of ε x σ increased after the flip chip/underfill process that produced the extra constraint from the chip. The maximum ε x σ of the layer in the flip chip assembly occurred at the interface with the metal via and its magnitude was about 0.48...
