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Keywords: Microscopic Moire´ Interferometry
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 294–300.
Published Online: May 15, 2000
...B. Han, Mem. ASME; P. Kunthong Thermo-mechanical deformations of microstructures in a surface laminar circuit (SLC) substrate are quantified by microscopic moire´ interferometry. Two specimens are analyzed; a bare SLC substrate and a flip chip package assembly. The specimens are subjected...