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Keywords: Mold Compound Moisture Uptake
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 334–339.
Published Online: December 12, 2002
... 12 12 2002 chip scale packaging failure analysis reliability substrates organic compounds moisture delamination moulding BT Substrate PCT (Pressure Cooked Test) Mold Compound Moisture Uptake CSP(Chip Scale Package) Failure Mechanism Reliability For the current...
