... adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer Thermomechanical stresses...

... be coated with smooth Au layers. The 260 °C bonding temperature is compatible with typical reflow temperature of Sn3.5Ag solders used in electronic industries. 22 10 2010 26 02 2011 22 06 2011 22 06 2011 adhesive bonding alumina ductility elemental semiconductors gold...

... force were multiplied by the corresponding factor of the number of particles. 17 01 2006 09 09 2007 08 05 2008 adhesive bonding anisotropic media conductive adhesives contact resistance delamination elastic moduli integrated circuit packaging internal stresses resins...

... the steady state of testing, the temperature gradients even out and the resistance value decreases. 11 01 2006 27 10 2006 adhesive bonding flip-chip devices integrated circuit reliability flip chip anisotropic conductive adhesive FR-4 sequential build-up process reliability...

... 03 06 2005 silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance...

... reliability of an anisotropic conductive adhesive bonded assembly during thermal cycling test is practically important. 1 Thermal and mechanical deformation of adhesive flip chip package during thermal cycling regime In this study, we investigated the thermal deformation of adhesive bonded flip...

... Science Foundation of China under Grant No. 90207013 and 985 project of Peking University, China. silicon conducting polymers micromechanical devices micromachining adhesive bonding fluorescence Raman spectra chip scale packaging photoresists DNA PCR Microchip Array Polymer...

... have an increasing selection of possible flip chip assembly processes, based primarily on cost, reliability and complexity. flip-chip devices integrated circuit packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging...

...–751]. Based on the aforementioned advantages, it is worth investigating the bonding properties at different curing conditions. In this work, a new type of UV curable ACA for chip-on-flex application is presented. The adhesive bonds of the chip-on-flex application are cured at different cure cycles...

... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...

... circuit interconnections integrated circuit reliability adhesion fracture toughness testing adhesive bonding ageing scanning electron microscopy integrated circuit packaging substrates Anisotropic Conductive Adhesive (ACA) Moisture Effect Peel Strength During the past few years...

.... C. Chan. 06 January 2004 08 June 2004 21 03 2005 chip scale packaging adhesive bonding wafer bonding adhesives organic compounds fracture toughness tensile strength tensile testing Wafer bonding may be considered as one of the enabling techniques, extending...