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1-4 of 4
Keywords: anisotropic media
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
Published Online: May 8, 2008
... force were multiplied by the corresponding factor of the number of particles. 17 01 2006 09 09 2007 08 05 2008 adhesive bonding anisotropic media conductive adhesives contact resistance delamination elastic moduli integrated circuit packaging internal stresses resins...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
.... anisotropic conductive adhesive lead-free assembly thermal aging temperature-humidity aging Z bond adhesive conductive adhesives electronics packaging surface mount technology microassembling integrated circuit packaging ball grid arrays ageing contact resistance anisotropic media 04...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
Published Online: June 3, 2005
... bonding anisotropic media deformation Weibull distribution acoustic microscopy One of the most important issues whether this interconnection technology is suitable to be used for flip chip application is thermal cycling reliability. Adhesive flip chip assemblies are typically manufactured...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
Published Online: February 14, 2005
... of the particle and exposing the underlying polymeric portion were also observed. 20 02 2004 14 02 2005 anisotropic media electronics packaging mechanical contact contact resistance abrasion friction mechanical testing adhesives anisotropic conductive film (ACF) mechanical shock...
