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Keywords: chemical cure shrinkage
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
Published Online: March 19, 2010
... that the energy release rates at reflow temperature are the suitable criteria for the estimation of interface delamination. Furthermore, it is found that underfill material properties (elastic modulus, CTE, and chemical cure shrinkage), fillet height, and silicon die thickness can be optimized to reduce the risk...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011010.
Published Online: February 13, 2009
..., the chemical cure shrinkage exerts important influence on the total deformation. Due to the complexity and time consuming of the calculation, it is almost impossible for an industry to carry out the numerical simulation using viscoelastic property, which is the most close to the real material property...