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Keywords: chemical cure shrinkage
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
Published Online: March 19, 2010
... that the energy release rates at reflow temperature are the suitable criteria for the estimation of interface delamination. Furthermore, it is found that underfill material properties (elastic modulus, CTE, and chemical cure shrinkage), fillet height, and silicon die thickness can be optimized to reduce the risk...
Journal Articles