...Hong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si 3...

... extensively in high-density electronics such as (PDA), mobile phone, (LCD), smart cards, and disk drives 2 . ACF Bumpless Reflow Reliability silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive...

... January 7, 2004; revision received July 22, 2004. Review conducted by: Y. C. Chan. 07 January 2004 22 July 2004 21 03 2005 silicon conducting polymers micromechanical devices micromachining adhesive bonding fluorescence Raman spectra chip scale packaging photoresists DNA...

... that the pressure cooker test could most effectively reveal the adhesion behavior. Manuscript received January 13, 2004; revision received November 10, 2004. Review conducted by: Y. C. Chan. 13 January 2004 10 November 2004 21 03 2005 conducting polymers flip-chip devices integrated...

... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...

... received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 adhesives packaging fine-pitch technology electrical conductivity conducting polymers nickel gold contact resistance The simple connection method using anisotropic conductive adhesive (ACA) is noted...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 flip-chip devices integrated circuit bonding integrated circuit packaging adhesives conducting polymers particle size finite element analysis heat transfer...

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 surface mount technology printed circuit accessories printed circuit testing adhesives impact testing impact strength filled polymers conducting polymers shear...

... conducting polymers Electronic devices manufacturers are interested in research and development of new materials and processes for forming ecologically friendly joints on PCB assembly level. Electrically conductive adhesives are the possible solution. Compared to the soldering technology...

..., for the help with the Weibull analysis. Jin, S., Tiefel, T. H., Chen, L-H., and Daringer, D. W., 1993, “Anisotropically Conductive Polymer Films With a Uniform Dispersion of Particles,” IEEE CHMT Transactions, 16 (8). Williams , D. J. , and Whalley , D. C. , 1993 , “ The Effects...