...Hong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si 3...

... 03 06 2005 silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance...

... Science Foundation of China under Grant No. 90207013 and 985 project of Peking University, China. silicon conducting polymers micromechanical devices micromachining adhesive bonding fluorescence Raman spectra chip scale packaging photoresists DNA PCR Microchip Array Polymer...

... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...

... that the pressure cooker test could most effectively reveal the adhesion behavior. Manuscript received January 13, 2004; revision received November 10, 2004. Review conducted by: Y. C. Chan. 13 January 2004 10 November 2004 21 03 2005 conducting polymers flip-chip devices integrated...

... received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 adhesives packaging fine-pitch technology electrical conductivity conducting polymers nickel gold contact resistance The simple connection method using anisotropic conductive adhesive (ACA) is noted...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 flip-chip devices integrated circuit bonding integrated circuit packaging adhesives conducting polymers particle size finite element analysis heat transfer...

... impact testing impact strength filled polymers conducting polymers shear strength bending strength scanning electron microscopy Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry. Currently, SMT mainly uses lead-tin as soldering...

... 2000 01 May 2002 12 12 2002 adhesives surface mount technology printed circuit manufacture Taguchi methods design of experiments mechanical properties conducting polymers Electronic devices manufacturers are interested in research and development of new materials...

... conditions, high reliability flip-chip anisotropically conductive adhesive joints on low-cost substrate can be achieved. Jin, S., Tiefel, T. H., Chen, L-H., and Daringer, D. W., 1993, “Anisotropically Conductive Polymer Films With a Uniform Dispersion of Particles,” IEEE CHMT Transactions, 16 (8...