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Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
.../17517571003763380 [26] ASME , 2007 , “ Test Uncertainty ,” ASME Paper No. PTC 19.1-2005. 10.1115/19.1-2005 e-mail:  chris.zhang@usask.ca 11 07 2020 24 08 2021 22 11 2021 flip-chip underfill surface energy conservation of energy Natural Science Foundation...
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging