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Keywords: contact resistance
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021005.
Published Online: June 11, 2012
... of steady state and transient operation of TECs on hot spot temperature reduction. Our numerical model incorporates the effect of Peltier cooling and Joule heating, due to the volumetric and contact resistances inside the TEC module, to analyze the temperature reduction at hot spots on the chip...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
Published Online: September 8, 2010
... ) of the conventional TEC as a function of r o c 05 11 2009 20 04 2010 08 09 2010 bismuth compounds contact resistance cooling Ge-Si alloys heat transfer microfluidics micromechanical devices Peltier effect refrigeration refrigerators semiconductor device models...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
Published Online: May 8, 2008
...Melida Chin; S. Jack Hu; James R. Barber Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a difficult challenge for the designers. The most important...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
... aging showed significance within the first 100 h. I – V characteristics of the daisy chained ball grid array devices assembled with and without bumps revealed considerable difference in the breakdown current. The correlation between initial contact resistance of the daisy chain and the final breakdown...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
Published Online: February 14, 2006
.... Typically, thermal interfaces are filled with materials such as thermal adhesives and greases. Interface materials reduce the contact resistance between the mating heat generating and heat sinking units by filling voids and grooves created by the nonsmooth surface topography of the mating surfaces, thus...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... ACF joints by maintaining low contact resistance. By contrast, high contact resistance was found in assemblies treated with higher reflow. Under humidity aging (85°C/85%RH), bumpless chips proved to be unreliable due to corrosion mechanism. Moreover, ACF had shown degradation in chemical and physical...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
Published Online: February 14, 2005
...Rashed Adnan Islam; Y. C. Chan The contact resistances investigated by this study of ACF joints using Au ∕ Ni bumps and flexible substrates are found to be increased by the induced mechanical shock and also by the combined effect of heat/humidity and the mechanical shock. The samples humidified...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 609–616.
Published Online: December 15, 2003
... received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 adhesives packaging fine-pitch technology electrical conductivity conducting polymers nickel gold contact resistance The simple connection method using anisotropic conductive adhesive (ACA) is noted...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 411–418.
Published Online: December 12, 2002
..., the variation of contact resistance with probing force is outlined. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 3, 2001. Associate Editor: B. Michel. 03 December 2001...
Topics: Springs, Stress
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 240–245.
Published Online: July 26, 2002
... of ultra fine pitch flip-chip interconnections using anisotropically conductive adhesives on a low-cost substrate. The reliability was characterized by single contact resistance measurement using the four-probe method during temperature cycling testing up to 3000 cycles. The Mean Time To Failure (MTTF...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 247–254.
Published Online: September 1, 2000
... of high-density land-grid array connectors involves trade-off between conflicting performance requirements on the normal force, wipe, bulk resistance, contact resistance, stress, contact z -dimensional thickness, and z -compression. These stringent design requirements have significantly shrunk the space...