... surface morphology ageing corrosion testing swelling humidity On the other hand, the conventional tin-lead (Sn-Pb) soldering as an interconnection method has been used widely in flip chips packaging for decades. The soldering can offer a large degree of flexibility in an assembly with low...

... is performed on the surfaces and cross sections of the housing. Finally, measurements are made of the thickness of the oxide layer on the surfaces of the fiber-optic transceiver housing. packaging optical receivers optical transmitters transceivers corrosion testing metallography humidity thermal...