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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
Published Online: May 24, 2024
...-mail:  agharai1@binghamton.edu 04 01 2024 22 04 2024 24 05 2024 multichip module liquid cooling heat sink data centers heat transfer The world is being inundated with an overwhelming amount of digital data from numerous sources, including social media, blog posts...
Journal Articles
Journal Articles