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1-4 of 4
Keywords: design of experiments
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
Published Online: July 30, 2008
...) detailed numerical analysis models directly connected to optimization algorithms, (2) design of experiments (DoE), and (3) artificial neural networks (ANNs) have been proposed as new trends in this field. These methodologies have led to significant improvement in design optimization capabilities, while...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 367–370.
Published Online: December 12, 2002
... mount technology printed circuit manufacture Taguchi methods design of experiments mechanical properties conducting polymers In order to identify the desirable formulation and the preferred material parameters of the electrically conductive adhesives under investigation, the design...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 83–87.
Published Online: April 10, 2000
... has been conducted to determine the maximum loading limit of organic flip chip package through design of experiment (DOE) approach. A material testing system has been utilized to simulate various loading conditions (ranging from 15 lb to 200 lb) on organic flip-chip test vehicles (FTV) during heat...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
Published Online: October 29, 1999
... of experiments Ball Grid Array (BGA) Crack Die Finite Element Analysis (FEA) Flip-Chip Fracture Mechanics Design Methodology Design of Experiment (DOE) Time to market has become a critical factor for electronics industry, which determines how much profit a company can make and how well...