.... e-mail:  debock@ge.com This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions. 15 01 2020 01 06 2020 29 06 2020 transient thermal management electronics packaging phase change materials codesign...

.... 31 10 2018 27 02 2019 thermal cycling mechanical cycling electronics packaging reliability accelerated testing fatigue life cycle Flip–chip packaging delivers several advantages over other packaging methods, including more compact packaging and improved thermal management...

... for the Thermal Mismatch Stresses at the Interface of a Uniformly Heated Two Layer Structure ,” Int. J. Electron. Packag. , 19 ( 3 ), pp. 323 – 329 . 9 Mirman , I. B. , 1991 , “ Effects of Peeling Stress in Bimaterial Assembly ,” ASME J. Electron. Packag. , 11 , pp. 431 – 433 . 10.1115/1.2905433...

...Etienne L. Bonnaud Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonic and cyclic loading at different strain rates. With regards...

..., and small factor packaging size. High-speed semiconductor laser diodes (LDs) are widely employed as the transmitters in Central Office (CO.) or customer terminals. computational electromagnetics electronics packaging microstrip lines modules optical interconnections optical modulation...

..., but time- and temperature-dependence. For simplification of the stress constitutive models, particularly for applications on electronic packaging can be found in literature, the time-dependent behavior could be neglected. Otherwise, the property only considered as a function of temperature can achieve time...

.... The results indicate that for the potted design, the dynamic response of the processor board is attenuated by the potting material. 14 12 2010 07 07 2011 08 12 2011 08 12 2011 electronics packaging thermal stresses transient analysis weapons Due to the highly dynamic...

...Yongchang Lee; Cemal Basaran Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where...

... components designers will have to cope with increasing numbers of hot spots on their chips, which drastically limit the operating range, even if the total applied power remains within current design rules of electronic packaging. To investigate that issue, a high power density was simulated from a small...

... Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates ”, ASME J. Electron. Packag. , 131 ( 3 ), pp. 0310011 – 0310016 . 10.1115/1.3144151 6 Solomon , H. D. , 1986 , “ Fatigue of 60/40 Solder ”, IEEE Trans. Compon. Hybrids Manuf. Technol. , CHMT-9 ( 4 ), pp. 423 – 432...

...M. O. Özdemir; H. Yüncü The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection...

... ) at 100 s; ( c ) at 1000 s; ( d ) at 1.57 × 10 + 6 s. 14 07 2010 30 05 2011 14 09 2011 14 09 2011 current density electromigration electronics packaging failure analysis numerical analysis reliability sensitivity analysis solders electromigration sensitivity...

...Tarek Ragab, Dr.; Cemal Basaran, Dr. 03 04 2011 01 06 2011 01 06 2011 01 07 2011 01 07 2011 carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes...

...) are able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross...

...Drazen Fabris; Michael Rosshirt; Christopher Cardenas; Patrick Wilhite; Toshishige Yamada; Cary Y. Yang Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle...

... was created for an opto-electronic package, and validated by experiments. The presented method gives a very good case study for such exercises. In the paper of Martinez-Galvan et al., “Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a,” experimental measurements...

... output only about 3% lower than that of the FTWL package. electronics packaging light emitting diodes phosphors silicon compounds light emitting diode correlated color temperature color-rendering index total internal reflection lumens Another important characteristic of a white...

... cooling copper electronics packaging laminar flow nanofluidics natural convection neural nets two-phase flow There has been a significant growth in the use of nanofluids in various industrial applications due to their enhanced thermophysical properties. Wong and De Leon ( 1 ) presented...

... , New York . Degl’Innocenti , S. , Lucchesi , M. , Padovani , C. , Pagni , A. , Pasquinelli , G. , and Zani , N. , 2007 , “ The Finite Element Code NOSA Version 2.0—User Manual ,” Internal Note ISTI 2007-B4-006. electronics packaging finite element analysis...

...Arun Prakash Raghupathy; John Janssen; Attila Aranyosi; Urmila Ghia; Karman Ghia; William Maltz In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using...