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Keywords: energy efficiency
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031007.
Paper No: EP-23-1068
Published Online: March 11, 2024
...R. Khalid; S. G. Schon; R. L. Amalfi; A. Ortega; A. P. Wemhoff This study aims to improve the combined energy efficiency of data center cooling systems and heating/cooling systems in surrounding premises by implementing a modular cooling approach on a 42 U IT rack. The cooling solution uses a close...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021005.
Paper No: EP-23-1016
Published Online: November 10, 2023
...R. Khalid; E. Youssef; R. L. Amalfi; A. Ortega; A. P. Wemhoff A thermosyphon-based modular cooling approach offers an energy efficient cooling solution with an increased potential for waste heat recovery. Central to the cooling system is an air-refrigerant finned tube heat exchanger (HX), where air...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041002.
Paper No: EP-21-1044
Published Online: October 6, 2021
... system, but only when coupled calculations are used. These results indicate that the coupled calculations impact predicted general energy efficiency metrics and enable statistically significant conclusions when comparing different data center cooling and power distribution strategies. where...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031001.
Paper No: EP-20-1016
Published Online: January 19, 2021
.../j.apenergy.2011.02.003 [6] Ellsworth
, Jr.
, M. J., and Iyengar, M. K., 2009 , “
Energy Efficiency Analyses and Comparison of Air and Water Cooled High Performance Servers ,” ASME Paper No. InterPACK2009-89248 . 10.1115/InterPACK2009-89248 [7]
Fernandes ,
J.
,
Ghalambor ,
S...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031116.
Paper No: EP-20-1018
Published Online: August 5, 2020
...Ismail Turkmen; Cem Ahmet Mercan; Hamza Salih Erden The share of equipment and power use in smaller data centers (DCs) is comparable with that of more massive counterparts. However, they grabbed less attention in the literature despite being less energy-efficient. This study highlights...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041004.
Paper No: EP-18-1058
Published Online: July 12, 2019
...Rehan Khalid; Aaron P. Wemhoff Two self-developed control schemes, ON/OFF and supervisory control and data acquisition (SCADA), were applied on a hybrid evaporative and direct expansion (DX)-based model data center cooling system to assess the impact of controls on reliability and energy efficiency...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... microprocessor chips temperature control thermal resistance Data center cooling thermal management chip to cooling tower energy efficiency heat sink © 2010 IEEE. Reprinted with permission from the “12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031006.
Published Online: September 9, 2010
...Emad Samadiani; Hrishikesh Amur; Bhavani Krishnan; Yogendra Joshi; Karsten Schwan Concurrency and exchanging design knowledge among thermal and IT management are required to achieve an energy efficient operational data center. In this paper, a design approach is presented to bring adaptability...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 360–369.
Published Online: December 13, 2005
... of a silicon-based processor operating at the speed of the human brain could be of the order of kilowatts or even megawatts ( 6 ). The development of such large power sources for mobile applications will be challenging to say the least. exergy thermal management energy efficiency chip performance...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 346–352.
Published Online: December 6, 2005
... are evolving in two directions. One direction is toward bigger and more sophisticated systems. The other is toward systems that are more compact and portable. In both cases, the energy efficiency is becoming an increasingly important design issue. This paper summarizes an exploration of the exergy cost...