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Keywords: fatigue cracks
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041011.
Published Online: December 8, 2010
... in each element. The elements that have reached the damage threshold are removed from the structure to initiate and propagate fatigue crack. This successive initiation approach is used to model crack initiation and propagation in Pb-free solder material under thermomechanical loading. A case study...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... is thus faced with a dilemma: While there exist models based on nonlinear fracture mechanics, their practical implementation is not straightforward and often raises more questions than it provides answers. In this paper, we attempt to address this issue by presenting a modeling approach for fatigue crack...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011003.
Published Online: January 31, 2008
...David M. Pierce; Sheri D. Sheppard; Paul T. Vianco; Jerome A. Regent; J. Mark Grazier A general fatigue life prediction methodology, based on a unified creep plasticity damage (UCPD) model, was developed for predicting fatigue cracks in 95.5Sn–3.9Ag–0.6Cu (wt %) solder interconnects...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
Published Online: October 4, 2006
... devices nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
Published Online: July 5, 2006
... B = 0.125938 , stress exponent n = 1.88882 , and grain size exponent m = 3.011 . The parameters of Coffin–Manson equation employed for fatigue crack-initiation life of eutectic 63Sn–37Pb solder material are: E...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
Published Online: March 14, 2003
... today, the model predicts that forces on the order of only one newton can significantly impede or accelerate the propagation of a fatigue crack. 2 A schematic of a row of solder interconnects being deformed as a result of a change in temperature when there is a disparity between the thermal...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
Published Online: December 12, 2002
...Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 147–154.
Published Online: July 26, 2002
.... Associate Editor: Yi-Hsin Pao. 26 June 2000 26 07 2002 soldering fatigue cracks Analytical models in engineering have several practical uses: 1) rapid design optimization during the development phase of a product, 2) predicting field use limits, and 3) failure analysis...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. December 2001, 123(4): 401–404.
Published Online: January 3, 2000
... greater than under static loading, indicating that stress corrosion effects are negligible and that crack tip plasticity controls cyclic fatigue crack growth at silane (3-APES) bonded epoxy/glass interfaces. After aging at 94°C in water, these silane bonded epoxy/glass interfaces exhibited somewhat...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 220–226.
Published Online: November 5, 1999
... growth or fatigue cracks, determine the damage growth rate; (2) at an intermediate mesoscale, the localized damage bands are modeled as variable stiffness springs connecting undamaged materials; and (iii) at the macroscale or the continuum level, the localized damage band growing in an otherwise...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 311–315.
Published Online: March 17, 1999
...J. Zhao and; Y. Mutoh; T. Ogawa The stress ratio effect on the fatigue crack growth behavior of 95Pb-5Sn solder has been investigated. It is found that both Δ J and Δ K can correlate fatigue crack growth data well, which means that the crack growth behavior of the 95Pb-5Sn solder under...