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Keywords: fatigue lifetime
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
Published Online: October 6, 2021
...-like Cu 6 Sn 5 existed in Sn-xAgCu 0.7 solders enables to enhance the hardness due to dense network of Ag 3 Sn precipitation and near eutectic point. As a result of plastic displacement decreases with higher Ag additions, better fatigue lifetime could be achieved at Ag content to 1.5 wt%. Besides...
