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Keywords: finite element method
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
Published Online: February 7, 2024
... for the reliability prediction of coaxial TSV is proposed. Based on finite element method (FEM), the training and validation datasets of the energy release rates (ERR) of the crack at the critical interface are calculated to construct the deep learning neural network. Six key structure parameters affecting...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031002.
Paper No: EP-23-1072
Published Online: January 12, 2024
... Corresponding author. e-mail:  mkshih@nfu.edu.tw 08 09 2023 10 11 2023 12 01 2024 double cantilever beam delamination finite element method hygrothermal stress genetic algorithm (GA) Ministry of Science and Technology, Taiwan 10.13039/501100004663 MOST-111-2221-E-150...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
Published Online: August 18, 2022
..., an automatic implementation procedure for the coupling of the abaqus with a self-written elastic BE code is introduced for elastic problems. In the mixed finite element method (FEM)-boundary element method (BEM) model, the effective stiffness and effective forces at the interfacial boundary are evaluated...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041006.
Published Online: October 21, 2009
...Jun Zeng; Renli Fu; Simeon Agathopoulos; Shaodong Zhang; Xiufeng Song; Hong He A finite element method was developed to predict the effective thermal conductivity of particle filled epoxy composites. Three-dimensional models, which considered the effect of filler geometry, filler aspect ratio...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 19–27.
Published Online: September 20, 2006
..., upper surface of the lead frame, of the molding model 24 02 2004 20 09 2006 integrated circuit packaging integrated circuit modelling moulding temperature distribution finite element analysis IC packaging molding process thermal stress finite element method...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
Published Online: March 21, 2005
... stresses stress analysis thermal expansion failure analysis elastic moduli encapsulation bending shrinkage finite element analysis Residual Stress Underfill Resins Bi-Material Strip Bending (BMSB) Finite Element Method Polymeric encapsulant plays a critical role in integrated...