...) 28 05 2010 24 08 2011 09 12 2011 09 12 2011 finite element analysis flip-chip devices optimisation In chip-to-substrate connections, the flip-chip connection has become important in high-performance packages due to its high density and low inductance, compared...

..., pure Ag joints have superior electrical and thermal properties. 27 01 2011 13 06 2011 30 09 2011 30 09 2011 bonding processes chromium copper electric properties flip-chip devices gold packaging silver soldering thermal expansion silver joints flip-chip...

.../1.1669118 11 08 2010 26 03 2011 23 06 2011 23 06 2011 automatic optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive...

..., underfill material properties are crucial to package reliability performance ( 1 2 ). amine-based phenolic-based reliability underfill adhesion ball grid arrays flip-chip devices fracture toughness testing plastic packaging reliability thermal expansion Young's modulus 06 08...

...) of δ . The distributed forces acting on the edges of the die are resolved into the direction of δ . 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer...

.... 461 – 465 . 10.1177/004051750307300515 EIA/JEDEC Standard , 1998 , Wire Bond Shear Test Method, Electronic Industries Alliance, EIA/JESD22–B116. 03 03 2009 19 09 2010 24 11 2010 24 11 2010 bonding processes electronics packaging flip-chip devices light...

... and utilized in production. On the other hand, the preliminary results in this study show that Ag flip-chip joints can indeed be fabricated at 250 ° C . 31 08 2009 01 05 2010 30 09 2010 30 09 2010 flip-chip devices integrated circuit bonding silver joints flip-chip direct...

... had a higher modulus, lower CTE, and slightly higher T g . 17 10 2009 06 06 2010 09 09 2010 09 09 2010 adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys The move...

...-chip devices integrated circuit reliability shrinkage thermal expansion 2010 American Society of Mechanical Engineers ...

... electronics packaging flip-chip devices light emitting diodes optical fibre networks POF flip-chip LED light coupling efficiency TIR Recent years have witnessed a phenomenal growth in bandwidth demand to facilitate the high-speed transmission of vast amounts of image, audio, and video data...

... applications. Furthermore, this study provides the design guideline to develop an advanced no-flow underfill having high performance at high temperature range for the lead-free application. differential scanning calorimetry electronics packaging flip-chip devices lead mass spectroscopic chemical...

... With Some Kinds of Underfill Material ,” J. Solid Mech. Mater. Eng. , 2 ( 8 ), pp. 987 – 998 . 10.1299/jmmp.2.987 18 09 2008 16 04 2009 23 06 2009 assembling bonding processes flip-chip devices interconnections reliability thermal analysis The semiconductor package...

... copper copper alloys electromigration failure analysis flip-chip devices gold alloys metallisation nickel alloys silver alloys solders substrates tin alloys electromigration reliability flip-chip solder joint substrate pad metallization An earlier version of this paper...

... accuracy at a relatively low cost. laser ultrasound flip chip solder bump local temporal coherence lead-free laser vibrometer chip scale packaging electronics packaging flip-chip devices laser beam applications light interferometry solders thermoelasticity ultrasonic applications...

... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...

.... delamination electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment 25 07 2005 19 03 2008 17 11 2008 Underfill materials are used in flip chip...

..., the measured insertion loss is less than 3 dB for frequencies of up to 35 GHz and the return loss is higher than 15 dB for frequencies of up to 29 GHz using CPS flip-chip configuration. 11 12 2007 09 04 2008 17 11 2008 coplanar waveguides flip-chip devices integrated circuit...

... electromigration is responsible for metallization failures that lead to an excessive increase in the resistance of the solder joints. electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu weight content copper alloys electromigration flip-chip devices gold nickel reliability...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

... for further processing of experimental data. 14 08 2007 07 01 2008 01 08 2008 flip-chip devices inspection modal analysis soldering solders surface mount technology Today’s electronic devices are compact, miniature, and high density, and surface mount technology is used...