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Keywords: granular structure
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
Published Online: December 12, 2002
... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division October 12, 2001. Associate Editor: Y.-H. Pao. 12 October 2001 12 12 2002 soldering lead alloys tin alloys fatigue cracks ageing cooling granular structure crystal...
