.... An experimental set up was prepared where a TE device was used in conjunction with heat exchanger and a cold plate to remove heat from electronics module. A finned copper rod in contact with hot side of TE device was used to reject the heat out to the ambient. The experimental set up was housed inside...

...   K the equation is not accurate enough. On top of this, the spreader’s h / k should be smaller than 5 to ensure reliable results. 15 11 2009 19 04 2010 09 09 2010 cooling cosmology heat exchangers heat transfer thermal resistance Heat spreading...

...Giulio Lorenzini; Simone Moretti Thermal conductance and loss of pressure are among the most relevant parameters based on which a heat exchanger has to be chosen. Starting from this observation this study treated and compared the performances of different exchanging systems, always in condition...

...T. L. Bergman Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε -NTU heat exchanger methodology, and is used to examine enhancement associated with use of H 2 O – Al 2 O 3 nanofluids in a heat sink...

... simulations were also conducted to guide the experimental program. Effective heat transfer coefficients were also reverse-engineered using CFD software and the experimental results. 18 01 2007 19 04 2007 computational fluid dynamics copper graphite heat exchangers power amplifiers...

...% over the entire temperature and power ranges. Manuscript received April 23, 2004; revision received June 22, 2004. Review conducted by B. Sammakia. 23 April 2004 22 June 2004 24 01 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat...

... modules heat exchangers product development cooling Electronic devices and equipment now permeate virtually every aspect of our daily life. Among the most ubiquitous of these is the electronic computer varying in size from the handheld personal digital assistant to large scale mainframes...

... in the study. Kraus, A. D., and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment , Hemisphere Publishing Corporation, Washington, DC. Kays, W. M., and London, A. L., 1984, Compact Heat Exchangers , 3rd Edition, McGraw-Hill, New York, NY. LaHaye , P. G. , Neugebauer...

..., companies are looking for innovative methods of providing system level cooling such as using soil heat exchangers. Numerical simulation using a system of lumped thermal capacitances coupled to a soil finite element model is used to predict the transient thermal behavior of a cabinet. The cabinet model has...