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Keywords: humidity
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021003.
Paper No: EP-20-1042
Published Online: August 27, 2020
.... Packaging Technol. , 33 ( 4 ), pp. 819 – 829 . 10.1109/TCAPT.2010.2080273 [13] Frisk , L. , and Saarinen-Pulli , K. S.-P. , 2014 , “ Reliability of Adhesive Joined Thinned Chips on Flexible Substrates Under Humid Conditions ,” Microelectron. Reliab. , 54 ( 9–10 ), pp. 2058...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011004.
Published Online: January 31, 2008
... in microelectronics; i.e., the saturated concentration is only a function of relative humidity regardless of temperature. A new analogy formulation based on the modified solubility is presented and the scheme is implemented to investigate its accuracy and applicability. The results from a simple case study...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... ACF joints by maintaining low contact resistance. By contrast, high contact resistance was found in assemblies treated with higher reflow. Under humidity aging (85°C/85%RH), bumpless chips proved to be unreliable due to corrosion mechanism. Moreover, ACF had shown degradation in chemical and physical...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 460–465.
Published Online: January 21, 2005
...Xu Chen; Shufeng Zhao; Linda Zhai The moisture absorption experiments of two kinds of molding compound are conducted. The diffusion at low temperature and humidity observes the Fick’s Law, but it does not strictly obey at higher temperature and humidity. The phenomena can be attributed...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 390–397.
Published Online: October 6, 2004
..., the rate of aging of Kapton-E polyimide is quantified as a function of temperature and humidity exposure using peel and tensile tests. An accelerated test methodology that accounts for both aging and fatigue and that can be used to evaluate the resistance of electronic products to polyimide deadhesion...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
Published Online: December 15, 2003
... pressure (MAP) sensing elements from a new supplier have exhibited negative voltage shifts after exposure to humidity. A hypothesis has been established that poor anodic bonding causes an angstrom-level gap between the silicon substrate and glass. Once moisture enters the gap in a vapor form and condenses...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 379–384.
Published Online: December 12, 2002
... to a 85% relative humidity and 85°C temperature (85%RH/85°C) test condition. Also, the average light optical power, receiver sensitivity, extinction ratio, and mask margin of transceiver modules subjected to 85%RH/85°C and 3.47V at 500, 1000, 1500, and 1600 h are provided. Furthermore, metallography...