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Keywords: indentation
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
Published Online: October 4, 2006
... the indenter tip is driven into the surface of the material, both elastic and plastic deformation processes occur, producing a loading and unloading cycle. After unloading, elastic deformation is recovered, so one can separate the elastic properties. In each load...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 71–75.
Published Online: May 12, 2006
.... (ii) The stress sensitivity decreases after stress relaxation in nanoindentation creep tests. The saturated value is 1 in three solder balls. (iii) The morphology of indented surface consists of three parts: initial indentation, power-law creep, and granular surface. It suggests that the transition...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 33–37.
Published Online: March 21, 2005
... and the hardness. An important assumption in the analysis of the indentation is that the indented medium is a semi-infinite plane or half space, i.e., it has an “infinite thickness.” In nanoindentation the analyzed material is often a thin film that is deposited on a substrate. If the modulus ratio is small, (soft...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 359–366.
Published Online: October 6, 2004
... ( ∼ 18 days); have been studied by an analysis using micro-shear testing and nano-indentation techniques. The shear test of the aged bumps showed a slight increase in shear strength after an initial period of aging ( ∼ 50 hours) as compared to the non-aged bumps, but a decrease after longer aging (e.g...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 276–285.
Published Online: August 12, 2004
... of a thin SiLK film on a silicon substrate. Indentation-creep experiments show that this SiLK film indeed responds in a viscoelastic way. This may be caused by the non fully cross-linked test samples prepared using nonstandard processing. Using the FEM simulation, we find that the behavior of this thin SiLK...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
Published Online: April 30, 2004
... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
Published Online: December 15, 2003
... in the ceramic layers. There is reasonably good overall agreement between the residual stresses obtained from the indentation experiments and the numerical simulations. Some discrepancies do exist, though, for measurements on cross-sectioned MLCC’s. Possible reasons for the differences are discussed...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 254–259.
Published Online: August 30, 2000
... has also been employed to slice other brittle materials such as alumina, quartz, glass, and ceramics. The manufacturing process of wiresaw is a free abrasive machining (FAM) process. Specifically, the wiresaw cuts brittle materials through the “rolling-indenting” and “scratch-indenting” processes...