... integrated circuit bonding scanning electron microscopy silicon thermal expansion solid state bonding gold electroplating microstructure silicon chip alumina substrate Even though plastic packages are popular these days, ceramic packages still play as a significant role in high...

... and utilized in production. On the other hand, the preliminary results in this study show that Ag flip-chip joints can indeed be fabricated at 250 ° C . 31 08 2009 01 05 2010 30 09 2010 30 09 2010 flip-chip devices integrated circuit bonding silver joints flip-chip direct...

... moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding flip chip bumping chip stacking chip on board manufacturing technology finite elements stress analysis micromechanics Research interest...

... of others. 10 07 2007 15 08 2007 12 02 2008 e-mail: amip.shah@hp.com ball grid arrays chip scale packaging compression moulding deformation encapsulation integrated circuit bonding integrated circuit interconnections References Intel® Stacked Chip Scale...

... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...

... 03 06 2005 silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance...

.... 13 January 2004 03 June 2004 21 03 2005 adhesive bonding curing adhesives mechanical testing fracture ultraviolet radiation effects electronics packaging Fourier transform spectra infrared spectra integrated circuit testing integrated circuit bonding scanning electron...

... OF ELECTRONIC PACKAGING . Manuscript received May 2003 2003; final revision November 2003. Associate Editor: K. Kishimoto. 01 May 2003 01 November 2003 08 07 2004 reliability surface morphology adhesion passivation integrated circuit packaging integrated circuit bonding flip-chip...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 flip-chip devices integrated circuit bonding integrated circuit packaging adhesives conducting polymers particle size finite element analysis heat transfer...

... viscoelasticity integrated circuit bonding encapsulation finite element analysis In recent years, electronic information appliances have a trend becoming ever lighter, thinner, and smaller. To accommodate this trend, in addition to the higher integration and the sophistication of semiconductor devices...

... Technical Editor: Yi-Hsin Pao. 01 November 1997 01 November 1999 flip-chip devices integrated circuit packaging soldering tin alloys lead alloys thermal stress cracking encapsulation life testing printed circuit testing finite element analysis integrated circuit bonding...

..., 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic microscopy Die Bonding Isothermal Solidification...