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Keywords: integrated circuit bonding
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
... integrated circuit bonding scanning electron microscopy silicon thermal expansion solid state bonding gold electroplating microstructure silicon chip alumina substrate Even though plastic packages are popular these days, ceramic packages still play as a significant role in high...
Journal Articles
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
Published Online: September 30, 2010
... and utilized in production. On the other hand, the preliminary results in this study show that Ag flip-chip joints can indeed be fabricated at 250 ° C . 31 08 2009 01 05 2010 30 09 2010 30 09 2010 flip-chip devices integrated circuit bonding silver joints flip-chip direct...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
... moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding flip chip bumping chip stacking chip on board manufacturing technology finite elements stress analysis micromechanics Research interest...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011011.
Published Online: February 12, 2008
... of others. 10 07 2007 15 08 2007 12 02 2008 e-mail: amip.shah@hp.com ball grid arrays chip scale packaging compression moulding deformation encapsulation integrated circuit bonding integrated circuit interconnections References Intel® Stacked Chip Scale...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 391–399.
Published Online: November 28, 2006
... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 flip-chip devices integrated circuit bonding integrated circuit packaging adhesives conducting polymers particle size finite element analysis heat transfer...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 414–419.
Published Online: September 17, 2003
... viscoelasticity integrated circuit bonding encapsulation finite element analysis In recent years, electronic information appliances have a trend becoming ever lighter, thinner, and smaller. To accommodate this trend, in addition to the higher integration and the sophistication of semiconductor devices...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 207–213.
Published Online: November 1, 1999
... Technical Editor: Yi-Hsin Pao. 01 November 1997 01 November 1999 flip-chip devices integrated circuit packaging soldering tin alloys lead alloys thermal stress cracking encapsulation life testing printed circuit testing finite element analysis integrated circuit bonding...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 168–171.
Published Online: March 15, 1999
..., 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic microscopy Die Bonding Isothermal Solidification...