... silicon chip alumina substrate adhesive bonding alumina ductility elemental semiconductors gold integrated circuit bonding scanning electron microscopy silicon thermal expansion 22 10 2010 26 02 2011 22 06 2011 22 06 2011 2011 American Society of Mechanical...

... bonding process electronic packaging integrated circuits flip-chip devices integrated circuit bonding 2010 American Society of Mechanical Engineers ...

... technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009 29 10 2009 The simulation of simultaneous...

... integrated circuit bonding integrated circuit interconnections The increased proliferation of embedded and mobile devices has led to a sharp rise in the demand for nonvolatile memory (NVM), which is essentially a storage device that can retain data after the power...

... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...

... extensively in high-density electronics such as (PDA), mobile phone, (LCD), smart cards, and disk drives 2 . ACF Bumpless Reflow Reliability silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive...

... Curing Degree Shear Load adhesive bonding curing adhesives mechanical testing fracture ultraviolet radiation effects electronics packaging Fourier transform spectra infrared spectra integrated circuit testing integrated circuit bonding scanning electron microscopy 13 January...

... OF ELECTRONIC PACKAGING . Manuscript received May 2003 2003; final revision November 2003. Associate Editor: K. Kishimoto. 01 May 2003 01 November 2003 08 07 2004 reliability surface morphology adhesion passivation integrated circuit packaging integrated circuit bonding flip-chip...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 flip-chip devices integrated circuit bonding integrated circuit packaging adhesives conducting polymers particle size finite element analysis heat transfer...

... by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received July 2002. Associate Editor: B. Courtois. 01 July 2002 17 09 2003 chip scale packaging thermoelasticity viscoelasticity integrated circuit bonding encapsulation...

... Editor: Yi-Hsin Pao. 01 November 1997 01 November 1999 flip-chip devices integrated circuit packaging soldering tin alloys lead alloys thermal stress cracking encapsulation life testing printed circuit testing finite element analysis integrated circuit bonding failure...

... circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic microscopy 15 March 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received...