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Keywords: integrated circuit metallisation
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041014.
Published Online: December 9, 2010
... to determine the reliability of the gold ball bonds ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... failures. To understand the second bond strength, a stitch pull test was conducted and the results showed the neck of the stitched wire cracks thus leaving behind a tail bond on the lead finger. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance surface morphology ageing corrosion testing swelling humidity...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
Published Online: July 26, 2002
...) or infrared techniques. reflow soldering chemical interdiffusion integrated circuit metallisation thick film circuits hybrid integrated circuits transmission electron microscopy X-ray chemical analysis X-ray diffraction electron diffraction palladium alloys silver alloys lead alloys...