... ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography 29 07 2009 09 08 2010 09 12...

... particles in bond pad aluminum metallization are the potential site of void nucleation. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids...

... 03 06 2005 silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance...

... solutions based on a duromer MID approach. Manuscript received January 6, 2004; revision received June 24, 2004. Review conducted by: Y. C. Chan. 06 January 2004 24 June 2004 21 03 2005 chip scale packaging encapsulation integrated circuit interconnections integrated circuit...

...) or infrared techniques. reflow soldering chemical interdiffusion integrated circuit metallisation thick film circuits hybrid integrated circuits transmission electron microscopy X-ray chemical analysis X-ray diffraction electron diffraction palladium alloys silver alloys lead alloys...