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Keywords: integrated circuit metallisation
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041014.
Published Online: December 9, 2010
... ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography 29 07 2009 09 08 2010 09 12...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... particles in bond pad aluminum metallization are the potential site of void nucleation. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids...
Journal Articles
Journal Articles
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
Published Online: July 26, 2002
...) or infrared techniques. reflow soldering chemical interdiffusion integrated circuit metallisation thick film circuits hybrid integrated circuits transmission electron microscopy X-ray chemical analysis X-ray diffraction electron diffraction palladium alloys silver alloys lead alloys...