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Keywords: integrated circuit testing
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability 19 03 2010 19 03 2010 Mechanical Design of Electronic Systems ,by Dally James W. Lall Pradeep Suhling Jeffrey C...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop impact reliability drop impact modeling chip scale...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 460–468.
Published Online: April 9, 2007
... 09 04 2007 finite element analysis integrated circuit interconnections integrated circuit reliability integrated circuit testing low-k dielectric thin films Power and latency are fast becoming major bottlenecks in the design of high performance microprocessors and computers...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 281–284.
Published Online: October 7, 2005
... chip scale packaging transient analysis thermal analysis ball grid arrays integrated circuit testing finite element analysis power cycling thermal cycling JEDEC transient thermal analysis The standards regulated by the Joint Electron Device Engineering Council (JEDEC) have been...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
Published Online: June 3, 2005
... integrated circuit testing heat sinks jets shear turbulence stagnation flow temperature distribution convection flow separation cooling Continued miniaturization of integrated chips is a consequence of recent developments in semiconductor technology and integrated circuit manufacturing...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 556–561.
Published Online: December 15, 2003
..., such as cracking of micro-vias. This study focuses on analyzing the solder fatigue failures due to PWB curvature loading. bending integrated circuit reliability chip scale packaging finite element analysis integrated circuit testing 01 November 2002 15 12 2003 Contributed...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 411–418.
Published Online: December 12, 2002
... 12 12 2002 micromechanical devices probes integrated circuit testing production testing fine-pitch technology contact resistance integrated circuit interconnections With the continued reduction in feature size and with the increased demand for better performance and lower cost...
Topics: Springs, Stress
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
Published Online: July 26, 2002
.... Associate Editor: Yi-Hsin Pao. 09 August 2000 26 07 2002 reflow soldering flip-chip devices creep chip scale packaging printed circuit manufacture integrated circuit reliability life testing integrated circuit testing By IPC’s definition, holes with 6 mils (0.15 mm...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 266–270.
Published Online: July 26, 2002
... integrated circuit reliability integrated circuit packaging ball grid arrays integrated circuit modelling life testing integrated circuit testing viscoplasticity stress analysis reflow soldering Rayleigh-Ritz methods failure analysis finite element analysis Recent years have witnessed...
Journal Articles
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 323–330.
Published Online: June 2, 2001
... OF ELECTRONIC PACKAGING . Manuscript received by the EPPD June 2, 2001, Associate Editor: B. Courtois. 02 June 2001 integrated circuit packaging integrated circuit testing thermal management (packaging) Although a number of different thermal test chips have been developed by different...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 335–340.
Published Online: March 30, 2000
... is referred to as characteristic life, and is the number of thermal cycles with 63.2 percent failure occurrence. ball grid arrays chip scale packaging ceramic packaging integrated circuit reliability failure analysis life testing environmental testing integrated circuit testing Weibull...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 279–280.
Published Online: January 9, 2000
... circuit testing An interesting work was published in the Journal of Electronic Packaging (June 1998), “Investigation of the Lead-On-Chip Package’s Reliability,” by P.-H. Tsao et al. 1 . This work demonstrates successful application of test chips. The work presents in detail the test procedure...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 227–232.
Published Online: December 20, 1999
... . Manuscript received by the EEPD April 13, 1999; revised manuscript received December 20, 1999. Associate Technical Editor: A. Tay. 13 April 1999 20 December 1999 integrated circuit packaging integrated circuit testing flip-chip devices ball grid arrays plastic packaging rough...