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Keywords: interface delamination
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
Published Online: March 19, 2010
... the assembly processes. Thermal expansion mismatch between different materials causes interface delamination between epoxy molding compound and silicon die as well as interface delamination between underfill and silicon die. The main objective of this study is to investigate the effects of underfill material...
