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Keywords: intermetallic compound
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Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
https://doi.org/10.1115/1.4052075
Published Online: October 6, 2021
... to 218.5 °C and temperature range of solid–liquid coexistence phase reduces at the same time. The Sn-Cu 0.7 matrix consisted of small particles of Cu 6 Sn 5 within β-Sn equiaxial grains and did not significantly influence solder hardness. Moreover, much intermetallic compound of plate-like Ag 3 Sn and rod...
View Article titled, Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
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Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature
Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
https://doi.org/10.1115/1.4052231
Published Online: September 13, 2021
... used for power modules is also important because power module failures can cause serious accidents and have large social and economic impacts. electromigration power module solder joint intermetallic compound coupled analysis current crowding 31 03 2021 05 08 2021 13 09...
View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model
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Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress