... ]. With the RoHS directive preventing the use of lead (Pb), lead-free solder joint fatigue in severe temperature environments has been widely studied among the electronic industry and academics [ 2 ]. Several fatigue models based on different fatigue criteria have therefore been developed over the years to assess...

.... , and Wang , S. L. , 2003 , “ Fatigue Crack Growth Behavior of Sn–Pb and Sn-Based Lead-Free Solders ,” Eng. Fract. Mech. , 70 , pp. 2187 – 2197 . 10.1016/S0013-7944(02)00252-7 [9] Pringle , Raghavan , and Malatkar , 2007 , “ Solder Joint Reliability of BGA Package Under End-User Handling...

... Based Lead Free Solder Joints ,” 11th Electronics Packaging Technology Conference , Singapore , pp. 283 – 291 . [5] Pang , H. L. , and Che , F. X. , 2006 , “ Drop Impact Analysis of Sn-Ag-Cu Solder Joints Using Dynamic High Strain Rate Plastic Strain as the Impact Driving Force...

... investigates the effects of creep strain on the difference of fatigue life due to the different strain rate in the tensile and compression regions. The creep strain of the lead-free solder Sn–3.0Ag–0.5Cu subjected to a cyclic loading was investigated using stepped ramp wave loading. The experimental results...

... were investigated using the split Hopkinson tensile bar experimental technique. Stress-strain curves of the three solders were obtained, and microstructure and fractography of the specimens before and after the tests were examined and presented. The experimental results show that the lead-free solders...

... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal...

...Wen-Ren Jong; Hsin-Chun Tsai; Hsiu-Tao Chang; Shu-Hui Peng In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies...

... for Lead-Free Solder ,” ASME J. Electron. Packag. 1043-7398 10.1115/1.2160514 , 128 ( 1 ), pp. 71 – 81 . Pierce , D. M. , Sheppard , S. D. , Fossum , A. F. , Vianco , P. T. , and Neilsen , M. K. , 2006 , “ Development of the Damage State Variable for a Unified Creep...

...John H. L. Pang; F. X. Che Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study...

...) solders flip-chip devices high-temperature electronics flip-chip bump/UBM BGA lead-free solder reliability test In packages, defects are mostly found in solder joints. To meet the requirement of environment protection, the related research and development of the lead-free solder become...

... compounds tin alloys silver alloys electrochemical machining dissolving dissolution of Ni and NiP layers lead-free solder intermetallic compounds Soldering is the most important method for joining components in electronics. Every component has at least two contacts to be joined...