... an activation energy of 0.87 eV and a Peck parameter of 2.29. MTTF value of 1.582 × 10 6 h at low bias current, 10 mA, has been evaluated. 20 07 2010 19 05 2011 14 09 2011 14 09 2011 failure analysis life testing light emitting diodes semiconductor device reliability...

... integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability 19 03 2010 19 03 2010 Mechanical Design of Electronic Systems ,by Dally James W. Lall Pradeep Suhling Jeffrey C...

.... 16 02 2008 06 04 2009 16 10 2009 damping desorption electronics packaging leak detection life testing micromechanical devices pressure sensors vacuum techniques vacuum packaging molecular flow leak rate MEMS packaging Much research on vacuum packaging...

... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...

... electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment Underfill materials are used in flip chip assemblies to enhance the thermomechanical reliability of the solder bumps...

... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal...

... (internal package volume), equivalent leak rates, and equivalent size of interconnected defects in the bonding zone. 16 08 2005 13 06 2006 micro-optomechanical devices electronics packaging encapsulation hermetic seals life testing Optical microelectro mechanical systems (MOEMS...

...Yi-Shao Lai; Chiu-Wen Lee; Chin-Li Kao The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions...

... for high-end and/or higher reliability applications partially due to the higher level of understanding of its service life. Testing its life with ATC made the reliability projection more conservative and accordingly ATC was accepted as standard test method. The average shear strain ( γ...

...Sony Mathew; Diganta Das; Michael Osterman; Michael Pecht; Robin Ferebee This paper presents an analysis of an unexpected failure during vibration and shock life test of an electronic circuit board that has been in use for more than 15 years. During testing, an aluminum bracket used to mount...

...-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu lead-free solder paste on lead-free printed circuit boards under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy density...

... 2004 electronics packaging fatigue testing solders life testing shear strength creep testing ductility tin alloys lead alloys Solders have been used as a connection material between electric parts. They receive low cycle fatigue damage during on/off switching caused...

... adhesion metallisation fatigue tensile testing humidity life testing A common failure mechanism of polyimide dielectric is deadhesion by aging-assisted fatigue. Fatigue crack growth results from thermo-mechanical and hygroscopic stresses induced by changes in the temperature and humidity...

... packaging life testing solders electronics packaging cracks stress effects finite element analysis There are many types of thermal fatigue models for determining the solder joint reliability of electronic packages, each with its own merits 1 . These models are dependent on package-level...

... for accelerated thermal cycling and qualification. military avionics life testing creep plastic deformation ball grid arrays In this work, commercially-available Super Ball Grid Array (SBGA) packages are considered for military avionics applications. These SBGA packages are assembled on organic...

... beyond any doubt. In particular, the dependence of rupture of time-dependent materials — such as polymers and polymer composites — on an applied constant load and temperature is of practical importance but yet not fully understood. reliability life testing Weibull distribution ultraviolet...

... 12 12 2002 reliability failure analysis life testing electronic equipment testing telecommunication standards product liability design engineering First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability...

...E. Suhir, ASME Fellow Drop tests are often substituted in qualification or life testing of microelectronic and optoelectronic products by shock tests. The existing (e.g., Telcordia) qualification specifications require that a short term load of the given magnitude and duration (say, an “external...

...E. Suhir Accelerated life tests (ALTs) are aimed at revealing and understanding the physics of the expected or occurred failures, i.e., are able to detect the possible failure modes and mechanisms. Another objective of the ALTs is to accumulate representative failure statistics. Adequately designed...

... absorption and diffusion through the polymeric underfill, and the resulting hygromechanical viscoplastic stress history. The simulations are combined with accelerated aging tests to assess in-service durability in hot, humid environments. Model predictions are compared with results of accelerated life tests...