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Keywords: linear algebra
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021002.
Published Online: April 15, 2008
... an accuracy of 2%. The junction temperature of the package is typically obtained by solving the linear algebraic network equations of the CTM, with the heat transfer to the ambience modeled by a convection coefficient obtained from handbooks, assuming identical ambient conditions imposed on all nodal surfaces...