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Keywords: mechanical properties
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011002.
Paper No: EP-20-1077
Published Online: August 6, 2021
...Zheng Liu; Li Yang; Yifeng Xiong; Huiming Gao The effect of trace Nb nanoparticles on the thermal properties, wettability, microstructure, and mechanical properties of Sn–0.7Cu solder alloy was investigated. The results showed that the melting temperature of Sn–0.7Cu composite solder alloy...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
Published Online: October 6, 2014
...: Felix Chen. 07 10 2013 29 06 2014 The elastic and plastic mechanical properties of intermetallic compound (IMC) phases of a lead-free Sn3.5Ag/Cu-substrate soldering system are investigated in different sized joints using nano-indentation. The specimens were prepared using solid...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 367–370.
Published Online: December 12, 2002
.... As the figure-of-merit, the individual joint resistance and adhesion between SMDs and PCBs were measured. It was found that the type of resin had the biggest influence on electrical and mechanical properties of adhesive joints. 04 December 2000 01 May 2002 12 12 2002 adhesives surface...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2000, 122(1): 74.
Published Online: March 1, 2000
...X. Q. Shi,; W. Zhou,; H. L. J. Pang, and; Z. P. Wang [S1043-7398(00)01601-7] eutectic alloys soldering thermomechanical treatment stress-strain relations mechanical properties The authors mistakenly stated that the paper “On Constitutive Response of 63/37 Pn/Sb Eutectic Solder...
