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Keywords: micromechanics
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
... technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009 29 10 2009 2009 American Society of Mechanical...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 262–267.
Published Online: June 26, 2004
...X. J. Fan; J. Zhou; G. Q. Zhang; L. J. Ernst A complete vapor pressure model based on a micromechanics approach is developed in this paper. The model can be extended to calculate the initial vapor pressure as traction loading subjected to the interfaces after the delamination. The impact...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 294–300.
Published Online: May 15, 2000
... 15 May 2000 plastic packaging flip-chip devices micromechanics circuit reliability shear deformation thermal stresses light interferometry Surface Laminar Circuit Flip Chip Underfill Microscopic Moire´ Interferometry Photosensitive Dielectric Layer Solder Resist Mask Metal...