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Keywords: multichip module
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Journal Articles

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
https://doi.org/10.1115/1.4065446
Published Online: May 24, 2024
...-mail:  agharai1@binghamton.edu 04 01 2024 22 04 2024 24 05 2024 multichip module liquid cooling heat sink data centers heat transfer The world is being inundated with an overwhelming amount of digital data from numerous sources, including social media, blog posts...
View Article titled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration <span class="search-highlight">Multichip</span> <span class="search-highlight">Module</span>
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Topics: Computer simulation, Cooling, Flow (Dynamics), Heat, Heat sinks, Multi-chip modules, Pressure drop, Temperature, Fluids, Coolants
Journal Articles

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Y. C. Lee, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
https://doi.org/10.1115/1.2804089
Published Online: January 25, 2007
...Y. C. Lee; C. J. Fang; M. C. Wu; C. H. Peng; Y. H. Hung An effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has been successfully developed. The design...
View Article titled, Heat-Transfer Optimization for <span class="search-highlight">Multichip</span> <span class="search-highlight">Module</span> Disks With an Unconfined Round Air Jet Impingement
Open the PDF for Heat-Transfer Optimization for <span class="search-highlight">Multichip</span> <span class="search-highlight">Module</span> Disks With an Unconfined Round Air Jet Impingement in another window
Topics: Design, Disks, Heat transfer, Multi-chip modules, Nozzles, Optimization, Reynolds number, Sensitivity analysis