... and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm 2 K/W and 5 mm 2 K/W, respectively. 01 12 2009 13 01 2011 23 06 2011 23 06 2011 carbon nanotubes elemental semiconductors interface structure mechanical stability MIS structures organic...

.... C. Chan. 06 January 2004 08 June 2004 21 03 2005 chip scale packaging adhesive bonding wafer bonding adhesives organic compounds fracture toughness tensile strength tensile testing Wafer bonding may be considered as one of the enabling techniques, extending...

... 12 12 2002 chip scale packaging failure analysis reliability substrates organic compounds moisture delamination moulding BT Substrate PCT (Pressure Cooked Test) Mold Compound Moisture Uptake CSP(Chip Scale Package) Failure Mechanism Reliability For the current...

... November 1998 18 Feb 2000 organic compounds cooling thermal management (packaging) jets boiling foils heating elements forced convection dielectric liquids Immersion cooling of integrated circuit chips by dielectric coolant received considerable interest in the 1970s and 1980s...