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Keywords: piezoelectric devices
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Journal Articles

In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors

Ben-Je Lwo, Jeng-Shian Su, Hsien Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031003.
https://doi.org/10.1115/1.3144149
Published Online: June 23, 2009
... an advanced packaging. piezoresistive sensor LFBGA packaging thermal stress finite element simulation ball grid arrays electronics packaging finite element analysis piezoelectric devices temperature sensors 24 03 2008 16 04 2009 23 06 2009 2009 American Society...
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Topics: Sensors, Simulation, Stress, Temperature, Packaging, Finite element analysis, Temperature sensors
Journal Articles

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

Mehrdad N. Ghasemi Nejhad, Mem. ASME, Chiling Pan, Hongwei Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
https://doi.org/10.1115/1.1512295
Published Online: March 14, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD September 1, 2000, Associate Editor: B. Michel. 01 September 2000 14 03 2003 piezoelectric devices piezoelectric thin films micromechanical devices finite element analysis stress analysis stress-strain relations...
View Article titled, Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures
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Topics: Finite element analysis, Modeling, Residual stresses, Stress, Stress analysis (Engineering), Temperature, Thin films, Microelectromechanical systems