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Keywords: plastic deformation
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
Published Online: October 4, 2006
... the indenter tip is driven into the surface of the material, both elastic and plastic deformation processes occur, producing a loading and unloading cycle. After unloading, elastic deformation is recovered, so one can separate the elastic properties. In each load...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 367–373.
Published Online: October 6, 2004
... PACKAGING . Manuscript received December 2003; final revision, March 2004. Associate Editor: Guo-Quon Lu. 01 December 2003 01 March 2004 06 10 2004 solders thermomechanical treatment tin alloys silver alloys copper alloys plastic deformation viscoplasticity electronics...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 273–281.
Published Online: October 6, 2004
...Samuel I-En Lin Thermal residual plastic deformation of bond joints on thin film based DWDM module under thermal cycles loading was investigated using three-dimensional finite element analysis. Finite element simulations were carried out to investigate the effect of the 4 and 6 solder-joint designs...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
Published Online: July 8, 2004
... to the field-use conditions. It should be noted here that the mechanisms of induced damage due to the plastic deformation and creep deformation are fundamentally different. In general the plastic deformation induces dislocations under the influence of shear stresses leading to slip bands, whereas the creep...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 135–141.
Published Online: April 30, 2004
... Cracking in Flip Chip Packages with Viscoplastic Solder Deformation” M. S. Thesis, Lehigh University, Bethlehem, PA. solders cracks semiconductor device packaging viscoplasticity plastic deformation fracture internal stresses Solder joint integrity is recognized as a key issue...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 82–86.
Published Online: April 30, 2004
... of stability of the compressive force at the contact face between a chip bump and a substrate pad. The key factor that dominates the interconnection reliability during temperature cycling is the amount of plastic strain in the chip bump (gold bump) at the contact face. The plastic deformation of the chip bump...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
Published Online: March 14, 2003
... lead alloys flip-chip devices chip-on-board packaging soldering thermal stress cracking plastic deformation acoustic microscopy inspection finite element analysis viscoelasticity viscoplasticity thermal expansion shear deformation interface phenomena modelling The development...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 234–239.
Published Online: July 26, 2002
... reliability chip scale packaging plastic deformation ball grid arrays flip-chip devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis 03 April 2001 26 07 2002 Contributed by the Electronic and Photonic Packaging...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
Published Online: May 2, 2002
.... , Sprecher , A. F. , and Conrad , H. , 1992 , “ Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue ,” ASME J. Electron. Packag. , 114 , pp. 112 – 117 . Contributed by the Electronic and Photonic Packaging Division for publication...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 27–36.
Published Online: March 13, 2001
... on the numerical results. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters March 13, 2001. Associate Editor: Y. C. Lee. 13 March 2001 plastic deformation hardness lead bonding...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 238–246.
Published Online: December 12, 2000
... plastic deformation packaging There has been growing interest in using Sn-Ag base alloys as alternative solder alloys for electronic packaging (e.g., Lead-Free Solder Project 1 ). First, Sn-Ag alloys contain no lead and therefore eliminate environmental concerns regarding lead content...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2001, 123(4): 405.
Published Online: September 19, 2000
... OF MECHANICAL ENGINEERS . Manuscript received by the EPPD September 19, 2000. Associate Editor: B. Michel. 19 September 2000 flip-chip devices thermal stress cracking copper plastic deformation soldering Formation of solder bumps for flip chips may cause cracks in the chip around...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 254–259.
Published Online: August 30, 2000
... , “ Fracture vs. plastic deformation processes in the sliding abrasive wear of ceramics ,” Measurement , 60 , pp. 123 – 127 . Broese, A., and Veldkamp, J. D., 1982, “Grinding brittle materials,” R. L. Williams, ed., Machining Hard Materials , pp. 131–135, Dearborn, MI, Soc. Manufacturing Engineers...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
Published Online: June 29, 2000
... alloys eutectic alloys soldering fatigue plastic deformation finite element analysis Tin (Sn)–lead (Pb) alloys with near eutectic compositions have been widely used as soldering materials in the package of semiconductor and communication devices. Although they possess good manufacturability...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 306–310.
Published Online: June 20, 2000
... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 121–127.
Published Online: November 29, 1999
..., 1999. Associate Technical Editor: John Lau. 29 November 1999 packaging thermal expansion finite element analysis thermal stresses plastic deformation Almost all electronic packages and assemblies contain components made of dissimilar materials having anisotropic time...