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1-4 of 4
Keywords: plates (structures)
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
Published Online: December 21, 2011
... to minimize or eliminate the risk of structural failure. bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
Published Online: December 9, 2011
... electronics packaging encapsulation plates (structures) polymers stress-strain relations viscoelasticity 02 12 2010 30 09 2011 09 12 2011 09 12 2011 References 1 Chen , C.-S. , Wang , T. H. , Lee , C.-C. , and Lai , Y.-S. , 2008 , “ Warpage Analyses...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011004.
Published Online: February 11, 2009
... spreading resistance heat sinks integrated circuit packaging plates (structures) thermal conductivity thermal management (packaging) thermal resistance 10 03 2008 06 05 2008 11 02 2009 The one-dimensional, spreading, and total resistances with the aspect ratio...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
Published Online: January 24, 2005
... by: B. Sammakia. 21 May 2004 19 July 2004 24 01 2005 heat sinks electronics packaging plates (structures) cooling convection jets nozzles flow simulation finite volume methods telecommunication Lee , D. Y. , and Vafai , K. , 1999 , “ Comparative...
