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Keywords: plates (structures)
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
Published Online: December 21, 2011
... adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer Thermomechanical stresses...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
Published Online: December 9, 2011
... CTE or nonconsidering residual strain, especially for temperature above T g . 02 12 2010 30 09 2011 09 12 2011 09 12 2011 electronics packaging encapsulation plates (structures) polymers stress-strain relations viscoelasticity thermomechanical analysis...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011004.
Published Online: February 11, 2009
... analytical solution spreading resistance heat sinks integrated circuit packaging plates (structures) thermal conductivity thermal management (packaging) thermal resistance 10 03 2008 06 05 2008 11 02 2009 2009 American Society of Mechanical Engineers ...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
Published Online: January 24, 2005
... by: B. Sammakia. 21 May 2004 19 July 2004 24 01 2005 heat sinks electronics packaging plates (structures) cooling convection jets nozzles flow simulation finite volume methods telecommunication The main objective of this study is to subject a flat parallel...