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Keywords: polymers
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
Published Online: December 9, 2011
... residual strain from polymer forming. Furthermore, the nonincrement approach is implemented by a concept of force and moment equilibrium on the flexural stiffness of final stage, and derived for efficiency enhancing. On the other hand, analytical solutions based on different conservation laws...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
Published Online: June 7, 2011
... to enhance the spreadability of the material. FTIR and Raman spectroscopy confirmed the presence of a variety of oxygen functional groups at the edges and basal plane of the functionalized graphite nanoplatelets, which contributed to improved interaction with the polymer matrix. A comparative statistical...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
Published Online: June 11, 2010
... the overall effectiveness of the TIM. Although significant amount of work has been done on understanding the thermal and moisture effects of various polymer materials used in microelectronic package assemblies, very limited work has been done to study the effect of temperature and moisture on TIM delamination...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041006.
Published Online: October 21, 2009
..., the numerical results indicated a ratio of conductivity of filler to matrix for achieving the maximum thermal conductivity. Peng , S. , and Landel , R. , 1975 , “ Induced Anisotropy of Thermal Conductivity of Polymer Solids Under Large Strains ,” J. Appl. Polym. Sci. 0021-8995 , 19 ( 1 ), pp...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2007, 129(1): 111.
Published Online: March 1, 2007
... makeup of these materials. This book would greatly compliment, as well as enhance, a graduate course in advanced materials. It would also be a useful desk reference and is recommended for materials engineers. Chapter 14 addresses conductive (electrically) polymers. The authors do a commendable job...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 229–235.
Published Online: October 22, 2006
... optoelectronics polymers stochastic processes surface emitting lasers viscoelasticity uncertainty stochastic characterization photonic system epoxy viscoelastic behavior dynamic mechanical analysis Monte Carlo simulation The demand for cost-effective optical transceivers and low-cost...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 23–29.
Published Online: May 11, 2005
...M. Bahrami; M. M. Yovanovich; E. E. Marotta A compact analytical model is proposed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The model assumes plastic deformation at microcontacts and joint temperatures less than the polymer’s glassy temperature...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
Published Online: March 21, 2005
...Man-Lung Sham; Jang-Kyo Kim Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 335–339.
Published Online: November 3, 2004
...-8086 , 21 , pp. 112 – 119 . 14 07 2004 03 11 2004 plastic packaging integrated circuit packaging transfer moulding encapsulation polymers integrated circuit modelling Wire Density Effect Wire Sweep Mold-Filling Analysis Transfer Molding Plastic Packaging of ICs...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 185–188.
Published Online: October 1, 2004
... of a Thermotropic Liquid Crystalline Polymer ,” Mech. Compos. Mater. Struct. 1075-9417 , 31 ( 2 ). R. L. Thorkildsen , 1964 , “ Engineering Design for Plastics ,” SPE Series , 5 , p. 297 . Hult , J. A. H. , Creep in Engineering Structures , Blaisdell , Massachusetts, pp. 30 – 33...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
Published Online: December 15, 2003
... moulding polymers internal stresses thermal stresses finite element analysis creep viscoelasticity At present, thermo-mechanical reliability of integrated circuit (IC) packages is still one of the major concerns in the electronic industry. Critical stress levels may be induced in the package...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 294–301.
Published Online: June 10, 2003
... 2003 integrated circuit packaging curing polymers flip-chip devices encapsulation microwave heating failure analysis The demand for more efficient and lower cost manufacturing processes, improved speed and reliability, and smaller package sizes continues to drive the search...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 302–307.
Published Online: June 10, 2003
... February 2001 08 April 2002 10 06 2003 encapsulation flip-chip devices microwave heating polymers curing delamination voids (solid) This paper discusses a new method for rapid curing of encapsulants such as underfills in flip-chips using variable frequency microwaves (VFM...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 371–373.
Published Online: December 12, 2002
... December 2000 01 May 2002 12 12 2002 polymers moulding equations of state extensometers differential scanning calorimetry shrinkage thermal expansion Epoxy molding compound (EMC) is commonly used in the plastic IC encapsulation. This compound is composed of an epoxy resin...
Journal Articles
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
Published Online: December 12, 2002
...Bernd Michel,, Guest Editor, Poly’2000 Co-chair; Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair 12 12 2002 reliability polymers adhesion adhesives plastic packaging integrated circuit packaging fracture mechanics stress effects thermal management (packaging...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 122–126.
Published Online: May 2, 2002
... circuit packaging integrated circuit reliability swelling moisture failure analysis stress analysis reflow soldering sensitivity analysis polymers Polymeric materials swell upon absorbing moisture. Differential swelling occurs between the polymeric and nonpolymeric materials, as well...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 97–105.
Published Online: May 2, 2002
...L. J. Ernst; C. van ’t Hof; D. G. Yang; M. S. Kiasat; G. Q. Zhang; H. J. L. Bressers; J. F. J. Caers; A. W. J. den Boer; J. Janssen Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill...